Inventor
LIU YUAN-LUNG
TW6 patents
Patents
6 patentsUS6358831B1Mar 19, 2002
Method for forming a top interconnection level and bonding pads on an integrated circuit chip
TAIWAN SEMICONDUCTOR MFG27 citations91
US6638867B2Oct 28, 2003
Method for forming a top interconnection level and bonding pads on an integrated circuit chip
TAIWAN SEMICONDUCTOR MFG13 citations82
US5705441AJan 6, 1998
Ion implant silicon nitride mask for a silicide free contact region in a self aligned silicide process
TAIWAN SEMICONDUCTOR MFG17 citations81
US6875682B1Apr 5, 2005
Mesh pad structure to eliminate IMD crack on pad
TAIWAN SEMICONDUCTOR MFG10 citations72
US7759797B2Jul 20, 2010
Bonding pad structure to minimize IMD cracking
TAIWAN SEMICONDUCTOR MFG1 citations61
US7135395B2Nov 14, 2006
Bonding pad structure to minimize IMD cracking
TAIWAN SEMICONDUCTOR MFG2 citations61