Inventor
VINES LANDON B
US12 patents
⚠️ This page may combine multiple inventors who share the name “VINES LANDON B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
VLSI TECHNOLOGY INC
9 patentsUS6048789AApr 11, 2000
IC interconnect formation with chemical-mechanical polishing and silica etching with solution of nitric and hydrofluoric acids
VLSI TECHNOLOGY INC72 citations93
US5434104AJul 18, 1995
Method of using corrosion prohibiters in aluminum alloy films
VLSI TECHNOLOGY INC26 citations91
US5745990AMay 5, 1998
Titanium boride and titanium silicide contact barrier formation for integrated circuits
VLSI TECHNOLOGY INC48 citations90
US5728602AMar 17, 1998
Semiconductor wafer manufacturing process with high-flow-rate low-pressure purge cycles
VLSI TECHNOLOGY INC37 citations90
US6016001AJan 18, 2000
Metal to amorphous silicon to metal anti-fuse structure
VLSI TECHNOLOGY INC24 citations89
US5610105AMar 11, 1997
Densification in an intermetal dielectric film
VLSI TECHNOLOGY INC49 citations89
US5899707AMay 4, 1999
Method for making doped antifuse structures
VLSI TECHNOLOGY INC19 citations83
US6007641ADec 28, 1999
Integrated-circuit manufacture method with aqueous hydrogen-fluoride and nitric-acid oxide etch
VLSI TECHNOLOGY INC9 citations72
US5493926AFeb 27, 1996
Method of identifying a weakest interface where delamination is most likely to occur in a multi-layer dielectric film stack
VLSI TECHNOLOGY INC7 citations65
KONINKL PHILIPS ELECTRONICS NV
3 patentsUS6429144B1Aug 6, 2002
Integrated circuit manufacture method with aqueous hydrogen fluoride and nitric acid oxide etch
KONINKL PHILIPS ELECTRONICS NV17 citations82
US6444502B1Sep 3, 2002
Method for forming strapless anti-fuse structure
KONINKL PHILIPS ELECTRONICS NV9 citations70
US6824448B1Nov 30, 2004
CMP polisher substrate removal control mechanism and method
KONINKL PHILIPS ELECTRONICS NV10 citations64