P

Inventor

LEE SUNG GUE

KR20 patents
⚠️ This page may combine multiple inventors who share the name “LEE SUNG GUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LG ELECTRONICS INC

17 patents
US7049178B2May 23, 2006

Method for fabricating semiconductor package and semiconductor package

LG ELECTRONICS INC96 citations96
US7304249B2Dec 4, 2007

Bonding pads for a printed circuit board

LG ELECTRONICS INC17 citations92
US7257891B2Aug 21, 2007

Method for forming bonding pads

LG ELECTRONICS INC18 citations92
US6740352B2May 25, 2004

Method for forming bonding pads

LG ELECTRONICS INC18 citations92
US6210518B1Apr 3, 2001

Method and fixture for manufacturing flexible printed circuit board

LG ELECTRONICS INC31 citations92
US6706564B2Mar 16, 2004

Method for fabricating semiconductor package and semiconductor package

LG ELECTRONICS INC28 citations91
US7208341B2Apr 24, 2007

Method for manufacturing printed circuit board

LG ELECTRONICS INC48 citations89
US6509634B1Jan 21, 2003

Chip mounting structure having adhesive conductor

LG ELECTRONICS INC15 citations84
US6954985B2Oct 18, 2005

Method for plugging holes in a printed circuit board

LG ELECTRONICS INC14 citations82
US7320173B2Jan 22, 2008

Method for interconnecting multi-layer printed circuit board

LG ELECTRONICS INC9 citations81
US6803257B2Oct 12, 2004

Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board

LG ELECTRONICS INC7 citations74
US6851184B2Feb 8, 2005

Method for manufacturing a printed circuit board

LG ELECTRONICS INC7 citations73
US6641983B1Nov 4, 2003

Method for forming exposed portion of circuit pattern in printed circuit board

LG ELECTRONICS INC12 citations68
US7098533B2Aug 29, 2006

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

LG ELECTRONICS INC4 citations63
US7189302B2Mar 13, 2007

Multi-layer printed circuit board and fabricating method thereof

LG ELECTRONICS INC5 citations60
US6849294B2Feb 1, 2005

Method for fabricating circuit pattern of printed circuit board

LG ELECTRONICS INC1 citations52
US7337535B2Mar 4, 2008

Hole plugging method for printed circuit boards, and hole plugging device

LG ELECTRONICS INC1 citations50

UNIV KOREA RES & BUS FOUND

1 patent

LEE KWANG TAE

1 patent

AHN HYEON WOO

1 patent