Inventor
WANG TONG-HONG
MY4 patents
Patents
4 patentsUS7259456B2Aug 21, 2007
Heat dissipation apparatus for package device
ADVANCED SEMICONDUCTOR ENG9 citations68
US7482204B2Jan 27, 2009
Chip packaging process
ADVANCED SEMICONDUCTOR ENG4 citations61
US7335982B2Feb 26, 2008
Chip package structure and chip packaging process
ADVANCED SEMICONDUCTOR ENG2 citations61
US8022534B2Sep 20, 2011
Semiconductor package using an active type heat-spreading element
ADVANCED SEMICONDUCTOR ENG6 citations60