Inventor
CHO SUNG-LAE
KR42 patents
⚠️ This page may combine multiple inventors who share the name “CHO SUNG-LAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
25 patentsUS7291556B2Nov 6, 2007
Method for forming small features in microelectronic devices using sacrificial layers
SAMSUNG ELECTRONICS CO LTD118 citations97
US7943502B2May 17, 2011
Method of forming a phase change memory device
SAMSUNG ELECTRONICS CO LTD26 citations92
US7727884B2Jun 1, 2010
Methods of forming a semiconductor device including a phase change material layer
SAMSUNG ELECTRONICS CO LTD19 citations92
US7642622B2Jan 5, 2010
Phase changeable memory cells and methods of forming the same
SAMSUNG ELECTRONICS CO LTD24 citations92
US7569417B2Aug 4, 2009
Method of forming a phase changeable material layer, a method of manufacturing a phase changeable memory unit, and a method of manufacturing a phase changeable semiconductor memory device
SAMSUNG ELECTRONICS CO LTD38 citations92
US7482616B2Jan 27, 2009
Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD39 citations92
US7473597B2Jan 6, 2009
Method of forming via structures and method of fabricating phase change memory devices incorporating such via structures
SAMSUNG ELECTRONICS CO LTD21 citations92
US7411208B2Aug 12, 2008
Phase-change memory device having a barrier layer and manufacturing method
SAMSUNG ELECTRONICS CO LTD20 citations92
US7265050B2Sep 4, 2007
Methods for fabricating memory devices using sacrificial layers
SAMSUNG ELECTRONICS CO LTD21 citations92
US6707724B2Mar 16, 2004
Apparatus for providing reference voltages to memory modules in a memory system
SAMSUNG ELECTRONICS CO LTD27 citations92
US8026543B2Sep 27, 2011
Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US8790976B2Jul 29, 2014
Method of forming semiconductor device having self-aligned plug
SAMSUNG ELECTRONICS CO LTD5 citations83
US8034683B2Oct 11, 2011
Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed
SAMSUNG ELECTRONICS CO LTD8 citations83
US7759667B2Jul 20, 2010
Phase change memory device including resistant material
SAMSUNG ELECTRONICS CO LTD17 citations83
US9318700B2Apr 19, 2016
Method of manufacturing a phase change memory device
SAMSUNG ELECTRONICS CO LTD3 citations73
US7523543B2Apr 28, 2009
Methods of forming magnetic memory devices including ferromagnetic spacers
SAMSUNG ELECTRONICS CO LTD7 citations73
US7485559B2Feb 3, 2009
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD7 citations73
US7838326B2Nov 23, 2010
Methods of fabricating semiconductor device including phase change layer
SAMSUNG ELECTRONICS CO LTD5 citations63
US7803654B2Sep 28, 2010
Variable resistance non-volatile memory cells and methods of fabricating same
SAMSUNG ELECTRONICS CO LTD6 citations63
US7867880B2Jan 11, 2011
Metal precursors for low temperature deposition and methods of forming a metal thin layer and manufacturing a phase-change memory device using the metal precursors
SAMSUNG ELECTRONICS CO LTD6 citations62
US7807497B2Oct 5, 2010
Phase-change material layers, methods of forming the same, phase-change memory devices having the same, and methods of forming phase-change memory devices
SAMSUNG ELECTRONICS CO LTD5 citations58
US8834968B2Sep 16, 2014
Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device
SAMSUNG ELECTRONICS CO LTD0 citations52
US7612359B2Nov 3, 2009
Microelectronic devices using sacrificial layers and structures fabricated by same
SAMSUNG ELECTRONICS CO LTD0 citations52
US8993441B2Mar 31, 2015
Methods of forming a thin layer and methods of manufacturing a phase change memory device using the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US7855145B2Dec 21, 2010
Gap filling method and method for forming semiconductor memory device using the same
SAMSUNG ELECTRONICS CO LTD0 citations41
SK HYNIX INC
4 patentsUS12439612B2Oct 7, 2025
Semiconductor device and manufacturing method of the semiconductor device
SK HYNIX INC0 citations61
US11974442B2Apr 30, 2024
Semiconductor device and manufacturing method of the semiconductor device
SK HYNIX INC0 citations61
US11707005B2Jul 18, 2023
Chalcogenide material, variable resistance memory device and electronic device
SK HYNIX INC0 citations58
US12520501B2Jan 6, 2026
Chalcogenide material and semiconductor device including the same
SK HYNIX INC0 citations57
AN HYEONG-GEUN
2 patentsBAE BYOUNG-JAE
2 patentsUS8142846B2Mar 27, 2012
Method of forming phase change material layer using Ge(II) source, and method of fabrication phase change memory device
BAE BYOUNG-JAE4 citations61
US8852686B2Oct 7, 2014
Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device
BAE BYOUNG-JAE0 citations51