P

Inventor

CHO SUNG-LAE

KR42 patents
⚠️ This page may combine multiple inventors who share the name “CHO SUNG-LAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

25 patents
US7291556B2Nov 6, 2007

Method for forming small features in microelectronic devices using sacrificial layers

SAMSUNG ELECTRONICS CO LTD118 citations97
US7943502B2May 17, 2011

Method of forming a phase change memory device

SAMSUNG ELECTRONICS CO LTD26 citations92
US7727884B2Jun 1, 2010

Methods of forming a semiconductor device including a phase change material layer

SAMSUNG ELECTRONICS CO LTD19 citations92
US7642622B2Jan 5, 2010

Phase changeable memory cells and methods of forming the same

SAMSUNG ELECTRONICS CO LTD24 citations92
US7569417B2Aug 4, 2009

Method of forming a phase changeable material layer, a method of manufacturing a phase changeable memory unit, and a method of manufacturing a phase changeable semiconductor memory device

SAMSUNG ELECTRONICS CO LTD38 citations92
US7482616B2Jan 27, 2009

Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD39 citations92
US7473597B2Jan 6, 2009

Method of forming via structures and method of fabricating phase change memory devices incorporating such via structures

SAMSUNG ELECTRONICS CO LTD21 citations92
US7411208B2Aug 12, 2008

Phase-change memory device having a barrier layer and manufacturing method

SAMSUNG ELECTRONICS CO LTD20 citations92
US7265050B2Sep 4, 2007

Methods for fabricating memory devices using sacrificial layers

SAMSUNG ELECTRONICS CO LTD21 citations92
US6707724B2Mar 16, 2004

Apparatus for providing reference voltages to memory modules in a memory system

SAMSUNG ELECTRONICS CO LTD27 citations92
US8026543B2Sep 27, 2011

Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US8790976B2Jul 29, 2014

Method of forming semiconductor device having self-aligned plug

SAMSUNG ELECTRONICS CO LTD5 citations83
US8034683B2Oct 11, 2011

Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed

SAMSUNG ELECTRONICS CO LTD8 citations83
US7759667B2Jul 20, 2010

Phase change memory device including resistant material

SAMSUNG ELECTRONICS CO LTD17 citations83
US9318700B2Apr 19, 2016

Method of manufacturing a phase change memory device

SAMSUNG ELECTRONICS CO LTD3 citations73
US7523543B2Apr 28, 2009

Methods of forming magnetic memory devices including ferromagnetic spacers

SAMSUNG ELECTRONICS CO LTD7 citations73
US7485559B2Feb 3, 2009

Semiconductor device and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD7 citations73
US7838326B2Nov 23, 2010

Methods of fabricating semiconductor device including phase change layer

SAMSUNG ELECTRONICS CO LTD5 citations63
US7803654B2Sep 28, 2010

Variable resistance non-volatile memory cells and methods of fabricating same

SAMSUNG ELECTRONICS CO LTD6 citations63
US7867880B2Jan 11, 2011

Metal precursors for low temperature deposition and methods of forming a metal thin layer and manufacturing a phase-change memory device using the metal precursors

SAMSUNG ELECTRONICS CO LTD6 citations62
US7807497B2Oct 5, 2010

Phase-change material layers, methods of forming the same, phase-change memory devices having the same, and methods of forming phase-change memory devices

SAMSUNG ELECTRONICS CO LTD5 citations58
US8834968B2Sep 16, 2014

Method of forming phase change material layer using Ge(II) source, and method of fabricating phase change memory device

SAMSUNG ELECTRONICS CO LTD0 citations52
US7612359B2Nov 3, 2009

Microelectronic devices using sacrificial layers and structures fabricated by same

SAMSUNG ELECTRONICS CO LTD0 citations52
US8993441B2Mar 31, 2015

Methods of forming a thin layer and methods of manufacturing a phase change memory device using the same

SAMSUNG ELECTRONICS CO LTD0 citations51
US7855145B2Dec 21, 2010

Gap filling method and method for forming semiconductor memory device using the same

SAMSUNG ELECTRONICS CO LTD0 citations41

SK HYNIX INC

4 patents

AN HYEONG-GEUN

2 patents

BAE BYOUNG-JAE

2 patents

OH GYU-HWAN

1 patent

G MAN CO LTD

1 patent

KIM DO-HYUNG

1 patent

PARK JEONG-HEE

1 patent

KIM IK-SOO

1 patent

PARK HYE-YOUNG

1 patent

PARK YOUNG-LIM

1 patent

LEE JIN-IL

1 patent

UNIV ULSAN FOUND IND COOP

1 patent