Inventor
TANAKA NAOTAKA
JP46 patents
⚠️ This page may combine multiple inventors who share the name “TANAKA NAOTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
24 patentsUS5608265AMar 4, 1997
Encapsulated semiconductor device package having holes for electrically conductive material
HITACHI LTD567 citations99
US6028364AFeb 22, 2000
Semiconductor device having a stress relieving mechanism
HITACHI LTD167 citations98
US5569960AOct 29, 1996
Electronic component, electronic component assembly and electronic component unit
HITACHI LTD105 citations98
US5895965AApr 20, 1999
Semiconductor device
HITACHI LTD58 citations96
US6130112AOct 10, 2000
Semiconductor device
HITACHI LTD20 citations93
US6049128AApr 11, 2000
Semiconductor device
HITACHI LTD21 citations93
US6911733B2Jun 28, 2005
Semiconductor device and electronic device
HITACHI LTD15 citations92
US6727583B2Apr 27, 2004
Semiconductor device
HITACHI LTD13 citations92
US6465876B1Oct 15, 2002
Semiconductor device and lead frame therefor
HITACHI LTD16 citations92
US6423571B2Jul 23, 2002
Method of making a semiconductor device having a stress relieving mechanism
HITACHI LTD35 citations92
US5637914AJun 10, 1997
Lead frame and semiconductor device encapsulated by resin
HITACHI LTD24 citations92
US5537884AJul 23, 1996
Method for measuring adhesion strength of resin material
HITACHI LTD18 citations82
US5359899ANov 1, 1994
Method for measuring adhesion strength of resin material
HITACHI LTD15 citations82
US7057278B2Jun 6, 2006
Semiconductor device
HITACHI LTD9 citations74
US6800945B2Oct 5, 2004
Multi-chip semiconductor device with specific chip arrangement
HITACHI LTD8 citations74
US6646350B2Nov 11, 2003
Semiconductor device
HITACHI LTD11 citations74
US6314819B1Nov 13, 2001
Method for measuring adhesion strength of resin material
HITACHI LTD7 citations74
US6070473AJun 6, 2000
Method for measuring adhesion strength of resin material
HITACHI LTD7 citations74
US6911734B2Jun 28, 2005
Semiconductor device and electronic device
HITACHI LTD10 citations73
US5837567ANov 17, 1998
Lead frame and semiconductor device
HITACHI LTD8 citations73
US6710610B1Mar 23, 2004
Socket for testing of semiconductor device, and semiconductor device and method of manufacturing the semiconductor device
HITACHI LTD3 citations63
US6297073B1Oct 2, 2001
Semiconductor device
HITACHI LTD1 citations63
US5698790ADec 16, 1997
Method for measuring adhesion strength of resin material
HITACHI LTD2 citations63
US6232653B1May 15, 2001
TSOP type semiconductor device
HITACHI LTD2 citations60
RENESAS TECH CORP
8 patentsUS7291929B2Nov 6, 2007
Semiconductor device and method of manufacturing thereof
RENESAS TECH CORP61 citations98
US6897570B2May 24, 2005
Semiconductor device and method of manufacturing same
RENESAS TECH CORP54 citations95
US7656030B2Feb 2, 2010
Semiconductor device
RENESAS TECH CORP28 citations92
US7253527B2Aug 7, 2007
Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
RENESAS TECH CORP34 citations92
US7759161B2Jul 20, 2010
Semiconductor device and method of manufacturing thereof
RENESAS TECH CORP19 citations84
US7365426B2Apr 29, 2008
Semiconductor device
RENESAS TECH CORP12 citations84
US7432594B2Oct 7, 2008
Semiconductor chip, electrically connections therefor
RENESAS TECH CORP17 citations83
US6844219B2Jan 18, 2005
Semiconductor device and lead frame therefor
RENESAS TECH CORP2 citations63
KAWASHITA MICHIHIRO
4 patentsUS8816506B2Aug 26, 2014
Semiconductor device and method of manufacturing the same
KAWASHITA MICHIHIRO41 citations97
US8324736B2Dec 4, 2012
Manufacturing process and structure of through silicon via
KAWASHITA MICHIHIRO19 citations92
US8106518B2Jan 31, 2012
Semiconductor device and method of manufacturing the same
KAWASHITA MICHIHIRO5 citations73
US8178977B2May 15, 2012
Semiconductor device and method of manufacturing the same
KAWASHITA MICHIHIRO3 citations62
RENESAS ELECTRONICS CORP
4 patentsUS7973415B2Jul 5, 2011
Manufacturing process and structure of through silicon via
RENESAS ELECTRONICS CORP34 citations92
US7906848B2Mar 15, 2011
Semiconductor device
RENESAS ELECTRONICS CORP8 citations84
US7897509B2Mar 1, 2011
Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP3 citations58
US8378459B2Feb 19, 2013
Semiconductor device, semiconductor wafer and manufacturing method of the same
RENESAS ELECTRONICS CORP0 citations46