Inventor
KONING PAUL
US13 patents
⚠️ This page may combine multiple inventors who share the name “KONING PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS6597575B1Jul 22, 2003
Electronic packages having good reliability comprising low modulus thermal interface materials
INTEL CORP90 citations97
US6489185B1Dec 3, 2002
Protective film for the fabrication of direct build-up layers on an encapsulated die package
INTEL CORP81 citations97
US7059048B2Jun 13, 2006
Wafer-level underfill process making use of sacrificial contact pad protective material
INTEL CORP18 citations91
US7794623B2Sep 14, 2010
Microelectronic device having liquid crystalline epoxy resins
INTEL CORP6 citations73
US7417111B2Aug 26, 2008
Liquid crystalline epoxy resins
INTEL CORP3 citations62
US7530164B2May 12, 2009
Wafer-level underfill process making use of sacrificial contact pad protective material
INTEL CORP1 citations51