Inventor
CRISP RICHARD DEWITT
US100 patents
⚠️ This page may combine multiple inventors who share the name “CRISP RICHARD DEWITT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CRISP RICHARD DEWITT
17 patentsUS8659143B2Feb 25, 2014
Stub minimization for wirebond assemblies without windows
CRISP RICHARD DEWITT32 citations98
US8659141B2Feb 25, 2014
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
CRISP RICHARD DEWITT37 citations98
US8610260B2Dec 17, 2013
Stub minimization for assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT35 citations98
US8513813B2Aug 20, 2013
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
CRISP RICHARD DEWITT39 citations98
US8436477B2May 7, 2013
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT48 citations98
US8436457B2May 7, 2013
Stub minimization for multi-die wirebond assemblies with parallel windows
CRISP RICHARD DEWITT45 citations98
US8405207B1Mar 26, 2013
Stub minimization for wirebond assemblies without windows
CRISP RICHARD DEWITT42 citations98
US8254155B1Aug 28, 2012
Stub minimization for multi-die wirebond assemblies with orthogonal windows
CRISP RICHARD DEWITT68 citations98
US8659142B2Feb 25, 2014
Stub minimization for wirebond assemblies without windows
CRISP RICHARD DEWITT31 citations96
US8653646B2Feb 18, 2014
Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
CRISP RICHARD DEWITT31 citations96
US8525327B2Sep 3, 2013
Stub minimization for assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT33 citations96
US8659139B2Feb 25, 2014
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT32 citations94
US8629545B2Jan 14, 2014
Stub minimization for assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT32 citations94
US8502390B2Aug 6, 2013
De-skewed multi-die packages
CRISP RICHARD DEWITT42 citations94
US8441111B2May 14, 2013
Stub minimization for multi-die wirebond assemblies with parallel windows
CRISP RICHARD DEWITT49 citations94
US8659140B2Feb 25, 2014
Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
CRISP RICHARD DEWITT31 citations93
US8278764B1Oct 2, 2012
Stub minimization for multi-die wirebond assemblies with orthogonal windows
CRISP RICHARD DEWITT36 citations93
INVENSAS CORP
11 patentsUS8670261B2Mar 11, 2014
Stub minimization using duplicate sets of signal terminals
INVENSAS CORP78 citations98
US8345441B1Jan 1, 2013
Stub minimization for multi-die wirebond assemblies with parallel windows
INVENSAS CORP70 citations98
US8981547B2Mar 17, 2015
Stub minimization for multi-die wirebond assemblies with parallel windows
INVENSAS CORP24 citations93
US8917532B2Dec 23, 2014
Stub minimization with terminal grids offset from center of package
INVENSAS CORP25 citations93
US8786069B1Jul 22, 2014
Reconfigurable pop
INVENSAS CORP14 citations84
US8723329B1May 13, 2014
In-package fly-by signaling
INVENSAS CORP13 citations84
US10008477B2Jun 26, 2018
Microelectronic element with bond elements to encapsulation surface
INVENSAS CORP5 citations73
US9728495B2Aug 8, 2017
Reconfigurable PoP
INVENSAS CORP2 citations73
US9679838B2Jun 13, 2017
Stub minimization for assemblies without wirebonds to package substrate
INVENSAS CORP3 citations73
US9368477B2Jun 14, 2016
Co-support circuit panel and microelectronic packages
INVENSAS CORP3 citations73
US9287216B2Mar 15, 2016
Memory module in a package
INVENSAS CORP3 citations73
TESSERA INC
8 patentsUS9000583B2Apr 7, 2015
Multiple die in a face down package
TESSERA INC26 citations93
US7793414B2Sep 14, 2010
Methods for forming connection structures for microelectronic devices
TESSERA INC18 citations93
US9013033B2Apr 21, 2015
Multiple die face-down stacking for two or more die
TESSERA INC12 citations84
US8436458B2May 7, 2013
Flip-chip, face-up and face-down wirebond combination package
TESSERA INC7 citations84
US7545029B2Jun 9, 2009
Stack microelectronic assemblies
TESSERA INC13 citations84
US7317249B2Jan 8, 2008
Microelectronic package having stacked semiconductor devices and a process for its fabrication
TESSERA INC15 citations84
US7262368B2Aug 28, 2007
Connection structures for microelectronic devices and methods for forming such structures
TESSERA INC10 citations84
US9806017B2Oct 31, 2017
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
TESSERA INC4 citations73
HABA BELGACEM
7 patentsUS8513817B2Aug 20, 2013
Memory module in a package
HABA BELGACEM65 citations98
US8823165B2Sep 2, 2014
Memory module in a package
HABA BELGACEM34 citations94
US8338963B2Dec 25, 2012
Multiple die face-down stacking for two or more die
HABA BELGACEM51 citations94
US8304881B1Nov 6, 2012
Flip-chip, face-up and face-down wirebond combination package
HABA BELGACEM28 citations93
US8928153B2Jan 6, 2015
Flip-chip, face-up and face-down centerbond memory wirebond assemblies
HABA BELGACEM13 citations84
US8787032B2Jul 22, 2014
Enhanced stacked microelectronic assemblies with central contacts
HABA BELGACEM7 citations84
US8222725B2Jul 17, 2012
Metal can impedance control structure
HABA BELGACEM7 citations84
RAMBUS INC
6 patentsUS6266730B1Jul 24, 2001
High-frequency bus system
RAMBUS INC137 citations99
US6067594AMay 23, 2000
High frequency bus system
RAMBUS INC125 citations99
US5940340AAug 17, 1999
Method and apparatus for writing to memory components
RAMBUS INC37 citations95
US5844855ADec 1, 1998
Method and apparatus for writing to memory components
RAMBUS INC60 citations95
US5680361AOct 21, 1997
Method and apparatus for writing to memory components
RAMBUS INC73 citations95
US5956284ASep 21, 1999
Method and apparatus for writing to memory components
RAMBUS INC17 citations92
ETRON TECH INC
1 patentShowing the top 50 of 100 patents by PatentIndex Score.