Inventor
FENG HSIEN-PING
TW12 patents
⚠️ This page may combine multiple inventors who share the name “FENG HSIEN-PING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
11 patentsUS7189650B2Mar 13, 2007
Method and apparatus for copper film quality enhancement with two-step deposition
TAIWAN SEMICONDUCTOR MFG28 citations92
US7030016B2Apr 18, 2006
Post ECP multi-step anneal/H2 treatment to reduce film impurity
TAIWAN SEMICONDUCTOR MFG22 citations92
US7432192B2Oct 7, 2008
Post ECP multi-step anneal/H2 treatment to reduce film impurity
TAIWAN SEMICONDUCTOR MFG11 citations83
US7026233B2Apr 11, 2006
Method for reducing defects in post passivation interconnect process
TAIWAN SEMICONDUCTOR MFG12 citations81
US7256120B2Aug 14, 2007
Method to eliminate plating copper defect
TAIWAN SEMICONDUCTOR MFG8 citations70
US7667835B2Feb 23, 2010
Apparatus and method for preventing copper peeling in ECP
TAIWAN SEMICONDUCTOR MFG0 citations51
US7262067B2Aug 28, 2007
Method for conductive film quality evaluation
TAIWAN SEMICONDUCTOR MFG1 citations51
US6985222B2Jan 10, 2006
Chamber leakage detection by measurement of reflectivity of oxidized thin film
TAIWAN SEMICONDUCTOR MFG0 citations51
US7528478B2May 5, 2009
Semiconductor devices having post passivation interconnections and a buffer layer
TAIWAN SEMICONDUCTOR MFG0 citations49
US7481910B2Jan 27, 2009
Method and apparatus for stabilizing plating film impurities
TAIWAN SEMICONDUCTOR MFG1 citations46
US7122471B2Oct 17, 2006
Method for preventing voids in metal interconnects
TAIWAN SEMICONDUCTOR MFG0 citations46