Inventor
HASE YUKITOSHI
JP9 patents
⚠️ This page may combine multiple inventors who share the name “HASE YUKITOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NITTO DENKO CORP
7 patentsUS7393757B2Jul 1, 2008
Method for separating semiconductor wafer from supporting member, and apparatus using the same
NITTO DENKO CORP10 citations82
US7384811B2Jun 10, 2008
Method of separating semiconductor wafer, and separating apparatus using the same
NITTO DENKO CORP16 citations82
US7811899B2Oct 12, 2010
Method for laminating substrate and apparatus using the method
NITTO DENKO CORP3 citations61
US8349106B2Jan 8, 2013
Adhesive tape joining method and adhesive tape joining apparatus
NITTO DENKO CORP1 citations51
US8038816B2Oct 18, 2011
Method and apparatus for separating protective tape from semiconductor wafer
NITTO DENKO CORP0 citations51
US7807004B2Oct 5, 2010
Method for joining adhesive tape
NITTO DENKO CORP0 citations51
US7078316B2Jul 18, 2006
Substrate joining apparatus
NITTO DENKO CORP1 citations50