Inventor
KUBO HIDEO
JP38 patents
⚠️ This page may combine multiple inventors who share the name “KUBO HIDEO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
25 patentsUS6888725B2May 3, 2005
Electronics device unit
FUJITSU LTD70 citations98
US7007506B2Mar 7, 2006
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
FUJITSU LTD109 citations97
US10212849B2Feb 19, 2019
Liquid immersion tank, and apparatus including liquid immersion tank
FUJITSU LTD23 citations94
US10015905B2Jul 3, 2018
Immersion cooling device and seal tank
FUJITSU LTD24 citations94
US10149408B2Dec 4, 2018
Liquid immersion bath for electronic device
FUJITSU LTD29 citations93
US6748755B2Jun 15, 2004
Refrigeration system utilizing incomplete evaporation of refrigerant in evaporator
FUJITSU LTD38 citations92
US7477519B2Jan 13, 2009
Electronic component package including heat spreading member
FUJITSU LTD17 citations84
US7999374B2Aug 16, 2011
Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
FUJITSU LTD7 citations83
US10080308B2Sep 18, 2018
Immersion cooling apparatus
FUJITSU LTD6 citations73
US9778709B2Oct 3, 2017
Evaporator, cooling device, and electronic apparatus
FUJITSU LTD6 citations73
US11064631B2Jul 13, 2021
Liquid immersion cooling device and information processing apparatus
FUJITSU LTD2 citations72
US10881019B2Dec 29, 2020
Cooling apparatus
FUJITSU LTD4 citations72
US10225951B2Mar 5, 2019
Liquid immersion tank of electronic equipment
FUJITSU LTD3 citations72
US9951999B2Apr 24, 2018
Cooling device and electronic equipment
FUJITSU LTD2 citations72
US9620435B2Apr 11, 2017
Evaporator, cooling device, and electronic device
FUJITSU LTD2 citations72
US7221571B2May 22, 2007
Package unit, printed board having the same, and electronic apparatus having the printed board
FUJITSU LTD6 citations63
US7872875B2Jan 18, 2011
Mounting board, height adjusting apparatus and mounting method
FUJITSU LTD2 citations62
US7834443B2Nov 16, 2010
Semiconductor device with molten metal preventing member
FUJITSU LTD4 citations62
US12557247B2Feb 17, 2026
Cooling device
FUJITSU LTD0 citations61
US9694433B2Jul 4, 2017
Method of joining cooling component
FUJITSU LTD0 citations51
US12289860B2Apr 29, 2025
Liquid cooling module
FUJITSU LTD0 citations50
US12173966B2Dec 24, 2024
Cooling device
FUJITSU LTD0 citations50
US11892246B2Feb 6, 2024
Cooling device
FUJITSU LTD0 citations48
US9949402B2Apr 17, 2018
Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus
FUJITSU LTD0 citations41
US10098264B2Oct 9, 2018
Air-conditioning apparatus
FUJITSU LTD0 citations39
NIPPON SODA CO
3 patentsUS7105272B2Sep 12, 2006
Acid-degradable resin compositions containing ketene-aldehyde copolymer
NIPPON SODA CO7 citations72
US7847045B2Dec 7, 2010
Acrylic acid-based polymer and method of producing the same
NIPPON SODA CO0 citations47
US7951887B2May 31, 2011
Process for producing a polymer
NIPPON SODA CO0 citations42
SO TSUYOSHI
3 patentsUS8264850B2Sep 11, 2012
Electronic device package with connection terminals including uneven contact surfaces
SO TSUYOSHI4 citations60
US8309888B2Nov 13, 2012
Electronic apparatus, power control device for controlling a heater, and method of controlling power control device
SO TSUYOSHI0 citations50
US8421219B2Apr 16, 2013
Semiconductor component having adhesive squeeze-out prevention configuration and method of manufacturing the same
SO TSUYOSHI0 citations49