Inventor
KIDA TSUYOSHI
JP25 patents
⚠️ This page may combine multiple inventors who share the name “KIDA TSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
8 patentsUS9917026B2Mar 13, 2018
Semiconductor device
RENESAS ELECTRONICS CORP13 citations83
US10312199B2Jun 4, 2019
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP3 citations73
US10141273B2Nov 27, 2018
Semiconductor device and manufacturing method thereof
RENESAS ELECTRONICS CORP3 citations73
US9905529B2Feb 27, 2018
Method for manufacturing semiconductor device
RENESAS ELECTRONICS CORP2 citations73
US9349678B2May 24, 2016
Chip having a pillar electrode offset from the bonding pad
RENESAS ELECTRONICS CORP3 citations72
US10347552B2Jul 9, 2019
Semiconductor device
RENESAS ELECTRONICS CORP1 citations62
US9054093B2Jun 9, 2015
Semiconductor device
RENESAS ELECTRONICS CORP1 citations52
US8002542B2Aug 23, 2011
Heat treatment jig and heat treatment jig set
RENESAS ELECTRONICS CORP1 citations51
MITSUBISHI GAS CHEMICAL CO
7 patentsUS10808103B2Oct 20, 2020
Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer
MITSUBISHI GAS CHEMICAL CO1 citations57
US12195566B2Jan 14, 2025
Film, laminate, semiconductor wafer with film layer, substrate for mounting semiconductor with film layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations56
US11935803B2Mar 19, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations56
US12534559B2Jan 27, 2026
Resin composition, resin sheet, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations49
US11053382B2Jul 6, 2021
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations47
US11924979B2Mar 5, 2024
Resin composition, laminate, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations46
US12568848B2Mar 3, 2026
Film, laminate, semiconductor wafer with film layer, substrate for mounting a semiconductor with film layer, and semiconductor device
MITSUBISHI GAS CHEMICAL CO0 citations45
NEC ELECTRONICS CORP
5 patentsUS7554211B2Jun 30, 2009
Semiconductor wafer and manufacturing process for semiconductor device
NEC ELECTRONICS CORP13 citations82
US7829439B2Nov 9, 2010
Laser beam processing method for making a semiconductor device
NEC ELECTRONICS CORP3 citations62
US7545024B2Jun 9, 2009
Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby
NEC ELECTRONICS CORP4 citations62
US7514800B2Apr 7, 2009
Semiconductor device and wire bonding method therefor
NEC ELECTRONICS CORP3 citations62
US7759223B2Jul 20, 2010
Semiconductor wafer and manufacturing process for semiconductor device
NEC ELECTRONICS CORP2 citations60
SAKATA KENJI
3 patentsUS8710651B2Apr 29, 2014
Semiconductor device and method for manufacturing the same
SAKATA KENJI15 citations82
US8404517B2Mar 26, 2013
Semiconductor device and method of manufacturing the same
SAKATA KENJI2 citations61
US8207619B2Jun 26, 2012
Semiconductor device and method of manufacturing the same
SAKATA KENJI2 citations61