Inventor
YU CHEEMEN
US32 patents
⚠️ This page may combine multiple inventors who share the name “YU CHEEMEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK CORP
20 patentsUS7550834B2Jun 23, 2009
Stacked, interconnected semiconductor packages
SANDISK CORP38 citations92
US7375415B2May 20, 2008
Die package with asymmetric leadframe connection
SANDISK CORP23 citations92
US7746661B2Jun 29, 2010
Printed circuit board with coextensive electrical connectors and contact pad areas
SANDISK CORP8 citations84
US7728411B2Jun 1, 2010
COL-TSOP with nonconductive material for reducing package capacitance
SANDISK CORP12 citations84
US7615409B2Nov 10, 2009
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
SANDISK CORP8 citations84
US7538438B2May 26, 2009
Substrate warpage control and continuous electrical enhancement
SANDISK CORP15 citations84
US7355283B2Apr 8, 2008
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK CORP10 citations84
US7772686B2Aug 10, 2010
Memory card fabricated using SiP/SMT hybrid technology
SANDISK CORP13 citations82
US7663216B2Feb 16, 2010
High density three dimensional semiconductor die package
SANDISK CORP2 citations63
US7967184B2Jun 28, 2011
Padless substrate for surface mounted components
SANDISK CORP4 citations62
US7952179B2May 31, 2011
Semiconductor package having through holes for molding back side of package
SANDISK CORP2 citations62
US7806731B2Oct 5, 2010
Rounded contact fingers on substrate/PCB for crack prevention
SANDISK CORP5 citations62
US7772047B2Aug 10, 2010
Method of fabricating a semiconductor die having a redistribution layer
SANDISK CORP2 citations62
US7763980B2Jul 27, 2010
Semiconductor die having a distribution layer
SANDISK CORP3 citations62
US7615861B2Nov 10, 2009
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
SANDISK CORP2 citations62
US7611927B2Nov 3, 2009
Method of minimizing kerf width on a semiconductor substrate panel
SANDISK CORP4 citations62
US7592699B2Sep 22, 2009
Hidden plating traces
SANDISK CORP1 citations62
US7435624B2Oct 14, 2008
Method of reducing mechanical stress on a semiconductor die during fabrication
SANDISK CORP4 citations58
US7939382B2May 10, 2011
Method of fabricating a semiconductor package having through holes for molding back side of package
SANDISK CORP1 citations52
US7772107B2Aug 10, 2010
Methods of forming a single layer substrate for high capacity memory cards
SANDISK CORP0 citations52