Inventor
VERMA VANI
US13 patents
⚠️ This page may combine multiple inventors who share the name “VERMA VANI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CYPRESS SEMICONDUCTOR CORP
7 patentsUS7105377B1Sep 12, 2006
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
CYPRESS SEMICONDUCTOR CORP21 citations92
US6562272B1May 13, 2003
Apparatus and method for delamination-resistant, array type molding of increased mold cap size laminate packages
CYPRESS SEMICONDUCTOR CORP24 citations89
US6331728B1Dec 18, 2001
High reliability lead frame and packaging technology containing the same
CYPRESS SEMICONDUCTOR CORP22 citations89
US7391104B1Jun 24, 2008
Non-stick detection method and mechanism for array molded laminate packages
CYPRESS SEMICONDUCTOR CORP9 citations82
US6853202B1Feb 8, 2005
Non-stick detection method and mechanism for array molded laminate packages
CYPRESS SEMICONDUCTOR CORP13 citations82
US6576491B1Jun 10, 2003
Methods for producing high reliability lead frame and packaging semiconductor die using such lead frame
CYPRESS SEMICONDUCTOR CORP5 citations71
US6730532B1May 4, 2004
Method and system for universal packaging in conjunction with a back-end integrated circuit manufacturing process
CYPRESS SEMICONDUCTOR CORP5 citations62