Inventor

DAI TIEJUN

US81 patents

⚠️ This page may combine multiple inventors who share the name “DAI TIEJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DAI TIEJUN

OMNIVISION TECH INC

Stacked chip image sensor with light-sensitive circuit elements on the bottom chip

Small pixels having dual conversion gain providing high dynamic range

High dynamic range image sensor read out architecture using in-frame multi-bit exposure control

Calibration circuitry and method for a time of flight imaging system

Stacked chip SPAD image sensor

Low power imaging system with single photon avalanche diode photon counters and ghost image reduction

High dynamic range CMOS image sensor design

Auto-zero techniques for lateral overflow integrating capacitor (LOFIC) readout image sensor

Hybrid CMOS image sensor with event driven sensing

High dynamic range high speed CMOS image sensor design

Stacked embedded SPAD image sensor for attached 3D information

Pixel-level oversampling for a time of flight 3D image sensor with dual range measurements

Die seal ring for integrated circuit system with stacked device wafers

Feed-forward technique for power supply rejection ratio improvement of bit line

Die seal ring for integrated circuit system with stacked device wafers

Image sensor apparatus and method for improved dynamic range with multiple readout circuit paths

Image sensor and pixel that has variable capacitance output or floating node

Imaging sensor with amplifier having variable bias and increased output signal range

Readout circuitry to mitigate column fixed pattern noise of an image sensor

Light source frequency detection circuit for image sensor

Switched-capacitor amplifier with improved reset phase

Zero DC current readout circuit for CMOS image sensor using a precharge capacitor

Switching techniques for fast voltage settling in image sensors

Blooming free high dynamic range image sensor read out architecture using in-frame multi-bit exposure control

Row decoder for high dynamic range image sensor using in-frame multi-bit exposure control

Time of flight imaging with improved initiation signaling

Programmable current source for a time of flight 3D image sensor

Entrenched transfer gate

Negative biased substrate for pixels in stacked image sensors

Precharged latched pixel cell for a time of flight 3D image sensor

Image sensor with fast intra-frame focus

High dynamic range image sensor read out architecture

Image sensor with substrate noise isolation

Event driven pixel for spatial information extraction

Feedback capacitor and method for readout of hybrid bonded image sensors

Bitline settling speed enhancement

Method and apparatus for data transmission in an image sensor

DAI TIEJUN

Circuit and photo sensor overlap for backside illumination image sensor

High conversion gain image sensor

Circuit and photo sensor overlap for backside illumination image sensor

Image sensor with pipelined column analog-to-digital converters

Image sensor with prismatic de-multiplexing

Pad and circuit layout for semiconductor devices

MAO DULI

Integrated circuit stack with integrated electromagnetic interference shielding

WANG RUI

Hybrid analog-to-digital converter having multiple ADC modes

MO YAOWU

Arithmetic counter circuit, configuration and application for high performance CMOS image sensors

NOZAKI HIDETOSHI

Entrenched transfer gate

QIAO WENHAO

Image sensor with integrated ambient light detection

ZHANG GUANGBIN

Imaging sensor having reduced column fixed pattern noise

KUANG JIANGTAO

Image sensor with optical filters having alternating polarization for 3D imaging