P

Inventor

KIM YOUNSANG

US8 patents
⚠️ This page may combine multiple inventors who share the name “KIM YOUNSANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Henkel IP & Holding GmbH

5 patents
US10242923B2Mar 26, 2019

Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages

Henkel IP & Holding GmbH1 citations57
US10913879B2Feb 9, 2021

Thermally conductive pre-applied underfill formulations and uses thereof

Henkel IP & Holding GmbH1 citations53
US9082840B2Jul 14, 2015

Coating adhesives onto dicing before grinding and micro-fabricated wafers

Henkel IP & Holding GmbH1 citations47
US9362105B2Jun 7, 2016

Pre-cut wafer applied underfill film on dicing tape

Henkel IP & Holding GmbH0 citations44
US9281182B2Mar 8, 2016

Pre-cut wafer applied underfill film

Henkel IP & Holding GmbH0 citations34

AMKOR TECHNOLOGY INC

1 patent
US7675180B1Mar 9, 2010

Stacked electronic component package having film-on-wire spacer

AMKOR TECHNOLOGY INC38 citations89

ST AMAND ROGER D

1 patent
US8072083B1Dec 6, 2011

Stacked electronic component package having film-on-wire spacer

ST AMAND ROGER D10 citations80

YUN HWANG KYU

1 patent
US8753959B2Jun 17, 2014

Coating adhesives onto dicing before grinding and micro-fabricated wafers

YUN HWANG KYU2 citations51