Inventor
LIBSCH FRANK R
US59 patents
⚠️ This page may combine multiple inventors who share the name “LIBSCH FRANK R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
36 patentsUS6580127B1Jun 17, 2003
High performance thin film transistor and active matrix process for flat panel displays
IBM37 citations93
US6338988B1Jan 15, 2002
Method for fabricating self-aligned thin-film transistors to define a drain and source in a single photolithographic step
IBM50 citations93
US6333728B1Dec 25, 2001
Method and apparatus for real-time on-off contrast ratio optimization in liquid crystal displays
IBM29 citations93
US6731064B2May 4, 2004
Yield enchancement pixel structure for active matrix organic light-emitting diode displays
IBM20 citations92
US6476787B1Nov 5, 2002
Multiplexing pixel circuits
IBM27 citations92
US6414665B2Jul 2, 2002
Multiplexing pixel circuits
IBM30 citations92
US6310594B1Oct 30, 2001
Driving method and circuit for pixel multiplexing circuits
IBM41 citations92
US6181398B1Jan 30, 2001
Multiple pixel driven mirror electrodes for improved aperture ratio of reflective displays
IBM28 citations92
US7853105B2Dec 14, 2010
Coupling element alignment using waveguide fiducials
IBM15 citations91
US7421160B1Sep 2, 2008
Coupling element alignment using waveguide fiducials
IBM36 citations91
US6403407B1Jun 11, 2002
Method of forming fully self-aligned TFT with improved process window
IBM21 citations91
US10423805B2Sep 24, 2019
Encryption engine with an undetectable/tamper-proof private key in late node CMOS technology
IBM5 citations84
US10032973B1Jul 24, 2018
Magnetically guided chiplet displacement
IBM10 citations84
US10002856B1Jun 19, 2018
Micro-LED array transfer
IBM13 citations84
US9989702B2Jun 5, 2018
Polarization rotator for silicon photonics
IBM8 citations84
US7780063B2Aug 24, 2010
Techniques for arranging solder balls and forming bumps
IBM12 citations84
US7613368B2Nov 3, 2009
Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types
IBM9 citations84
US9057844B2Jun 16, 2015
Grating edge coupler and method of forming same
IBM10 citations83
US6566687B2May 20, 2003
Metal induced self-aligned crystallization of Si layer for TFT
IBM10 citations74
US10830724B2Nov 10, 2020
Micro-capacitance sensor array containing spaced apart first and second overlapping and parallel electrode plates for sensing analytes
IBM3 citations73
US10319893B2Jun 11, 2019
Magnetically guided chiplet displacement
IBM2 citations73
US10170036B2Jan 1, 2019
Systems and methods for displaying images
IBM2 citations73
US6872974B2Mar 29, 2005
Low threshold voltage instability amorphous silicon field effect transistor structure and biasing for active matrix organic light-emitting diodes
IBM11 citations69
US10923458B2Feb 16, 2021
Vertical light emitting diode with magnetic back contact
IBM0 citations63
US7891538B2Feb 22, 2011
Techniques for arranging solder balls and forming bumps
IBM2 citations63
US11216595B2Jan 4, 2022
Encryption engine with an undetectable/tamper-proof private key in late node CMOS technology
IBM0 citations62
US11016048B2May 25, 2021
Micro-capacitance sensor array containing spaced apart first and second overlapping and parallel electrode plates for sensing analytes
IBM0 citations62
US10997321B2May 4, 2021
Encryption engine with an undetectable/tamper proof private key in late node CMOS technology
IBM0 citations62
US9411106B2Aug 9, 2016
Polarization-independent grating coupler for silicon on insulator
IBM2 citations62
US9091819B2Jul 28, 2015
Grating edge coupler and method of forming same
IBM2 citations62
US7542643B2Jun 2, 2009
Coupling element alignment using waveguide fiducials
IBM2 citations61
US11161281B2Nov 2, 2021
Structure and method for monitoring directed self-assembly pattern formation
IBM0 citations52
US10875351B2Dec 29, 2020
Electrical component assembly on flexible materials
IBM0 citations52
US10573625B2Feb 25, 2020
Vertical light emitting diode with magnetic back contact
IBM0 citations52
US10559555B2Feb 11, 2020
Micro-LED array transfer
IBM0 citations52
US10391805B2Aug 27, 2019
Electrical component assembly on flexible materials
IBM0 citations52
BUDD RUSSELL A
6 patentsUS8483253B2Jul 9, 2013
3D optoelectronic packaging
BUDD RUSSELL A27 citations92
US8111730B2Feb 7, 2012
3D optoelectronic packaging
BUDD RUSSELL A20 citations92
US8411719B2Apr 2, 2013
3D optoelectronic packaging
BUDD RUSSELL A8 citations83
US9341828B2May 17, 2016
Multi-core fiber optical coupling elements
BUDD RUSSELL A5 citations73
US8596879B2Dec 3, 2013
Method to reorder (shuffle) optical cable waveguide layers
BUDD RUSSELL A2 citations63
US8087566B2Jan 3, 2012
Techniques for arranging solder balls and forming bumps
BUDD RUSSELL A4 citations63
TOPPOLY OPTOELECTRONICS CORP
2 patentsANDRY PAUL S
2 patentsHOUGHAM GARETH
2 patentsGLOBALFOUNDRIES INC
2 patentsShowing the top 50 of 59 patents by PatentIndex Score.