Inventor

TSUKAHARA NORIHITO

JP42 patents

⚠️ This page may combine multiple inventors who share the name “TSUKAHARA NORIHITO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSUKAHARA NORIHITO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Mounting method of semiconductor element

Semiconductor device and manufacturing method thereof

Connecting structure of circuit board and method for manufacturing the same

Method of forming a ball bond using a bonding capillary

Mounting method of semiconductor element

Circuit board having electrodes and pre-deposit solder receiver

Package of semiconductor device and method of manufacture thereof

Semiconductor device package manufacturing method and semiconductor device package manufactured by the method

Two-step projecting bump for semiconductor chip and method for forming the same

Electronic circuit device and method of manufacturing the same

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Circuit board and method of manufacturing the same

Circuit board and its manufacturing method

Semiconductor element having protruded bump electrodes

Semiconductor element having protruded bump electrodes

High density multilayer circuit module

Circuit board fabrication method and circuit board

Interconnection substrate and fabrication method thereof

Electronic circuit device and its manufacturing method

Manufacturing method for electronic component-mounted component, manufacturing method for electronic component-mounted completed product with the electronic component-mounted component, and electronic component-mounted completed product

Multilayered circuit board forming method and multilayered circuit board

Method for assembling integral type electronic component and integral type electronic component

Method for mounting parts and making an IC card

Wiring board and method of manufacturing the same

Circuit board and its manufacturing method

PANASONIC CORP

Electronic circuit device and method for manufacturing same

Storage medium with built-in antenna

Semiconductor memory module having built-in antenna

Semiconductor device and method for manufacturing the same

Antenna built-in module, card type information device, and methods for manufacturing them

Semiconductor device having a porous nickel plating part

Pressed-contact type semiconductor device and method for manufacturing the same

PANASONIC IP MAN CO LTD

Ion-sensitive substance, ion-sensitive membrane using the same, and method for producing the ion-sensitive substance

Fiber assembly and method for producing fiber assembly

Device and method for manufacturing fiber assembly

Antenna structure and antenna array structure

Field asymmetric ion mobility spectrometer and method for separating mixture using the same

KOYAMA MASAYOSHI

Paste dispenser for applying paste containing fillers using nozzle with pin and application method using the same

Circuit board and method for jointing circuit board

OKI AKIO

Method for forming artificial lipid membrane

HIROSE TAKAYUKI

Wiring board and wiring board manufacturing method

TSUKAHARA NORIHITO

Method of joining electronic component and the electronic component