Inventor
FUKUSHIMA DAI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “FUKUSHIMA DAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
20 patentsUS6611060B1Aug 26, 2003
Semiconductor device having a damascene type wiring layer
TOSHIBA KK26 citations93
US7042099B2May 9, 2006
Semiconductor device containing a dummy wire
TOSHIBA KK35 citations92
US6935928B2Aug 30, 2005
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
TOSHIBA KK24 citations92
US6858936B2Feb 22, 2005
Semiconductor device having an improved construction in the interlayer insulating film
TOSHIBA KK15 citations92
US6576554B2Jun 10, 2003
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process
TOSHIBA KK25 citations92
US6312321B1Nov 6, 2001
Polishing apparatus
TOSHIBA KK22 citations92
US7419910B2Sep 2, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK12 citations84
US7842191B2Nov 30, 2010
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
TOSHIBA KK7 citations74
US7144804B2Dec 5, 2006
Semiconductor device and method of manufacturing the same
TOSHIBA KK6 citations74
US9539696B2Jan 10, 2017
Retainer ring, polish apparatus, and polish method
TOSHIBA KK6 citations73
US7833431B2Nov 16, 2010
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
TOSHIBA KK3 citations63
US7521350B2Apr 21, 2009
Manufacturing method of a semiconductor device
TOSHIBA KK4 citations63
US7465668B2Dec 16, 2008
Method of manufacturing semiconductor device
TOSHIBA KK3 citations63
US7307023B2Dec 11, 2007
Polishing method of Cu film and method for manufacturing semiconductor device
TOSHIBA KK2 citations63
US6984582B2Jan 10, 2006
Method of making semiconductor device by polishing with intermediate clean polishing
TOSHIBA KK5 citations63
US6897143B2May 24, 2005
Method of manufacturing semiconductor device including two-step polishing operation for cap metal
TOSHIBA KK3 citations63
US9502318B2Nov 22, 2016
Polish apparatus, polish method, and method of manufacturing semiconductor device
TOSHIBA KK2 citations62
US9296083B2Mar 29, 2016
Polishing apparatus and polishing method
TOSHIBA KK0 citations52
US7682975B2Mar 23, 2010
Semiconductor device fabrication method
TOSHIBA KK0 citations52
US7494931B2Feb 24, 2009
Method for fabricating semiconductor device and polishing method
TOSHIBA KK1 citations52
TOSHIBA MEMORY CORP
5 patentsUS9849558B2Dec 26, 2017
Polishing pad dresser, polishing apparatus and polishing pad dressing method
TOSHIBA MEMORY CORP2 citations73
US9748090B2Aug 29, 2017
Semiconductor manufacturing apparatus and manufacturing method of semiconductor device
TOSHIBA MEMORY CORP2 citations73
US9902038B2Feb 27, 2018
Polishing apparatus, polishing method, and semiconductor manufacturing method
TOSHIBA MEMORY CORP3 citations72
US11097397B2Aug 24, 2021
Polishing device, polishing method, and record medium
TOSHIBA MEMORY CORP1 citations60
US10441979B2Oct 15, 2019
Cleaning apparatus and cleaning method
TOSHIBA MEMORY CORP0 citations41
FUKUSHIMA DAI
3 patentsUS8152598B2Apr 10, 2012
Substrate treating method and substrate treating apparatus
FUKUSHIMA DAI13 citations82
US8778802B2Jul 15, 2014
Polishing method and method for fabricating semiconductor device
FUKUSHIMA DAI2 citations61
US8506362B2Aug 13, 2013
Polishing apparatus and polishing method
FUKUSHIMA DAI0 citations50