Inventor
MINAMIHABA GAKU
JP63 patents
⚠️ This page may combine multiple inventors who share the name “MINAMIHABA GAKU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
46 patentsUS6740590B1May 25, 2004
Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writing
TOSHIBA KK102 citations98
US6454819B1Sep 24, 2002
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
TOSHIBA KK108 citations98
US6375545B1Apr 23, 2002
Chemical mechanical method of polishing wafer surfaces
TOSHIBA KK131 citations98
US5592024AJan 7, 1997
Semiconductor device having a wiring layer with a barrier layer
TOSHIBA KK133 citations98
US6794286B2Sep 21, 2004
Process for fabricating a metal wiring and metal contact in a semicondutor device
TOSHIBA KK55 citations96
US7166017B2Jan 23, 2007
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK23 citations93
US6858539B2Feb 22, 2005
Post-CMP treating liquid and method for manufacturing semiconductor device
TOSHIBA KK24 citations93
US6794285B2Sep 21, 2004
Slurry for CMP, and method of manufacturing semiconductor device
TOSHIBA KK19 citations93
US6611060B1Aug 26, 2003
Semiconductor device having a damascene type wiring layer
TOSHIBA KK26 citations93
US7042099B2May 9, 2006
Semiconductor device containing a dummy wire
TOSHIBA KK35 citations92
US6935928B2Aug 30, 2005
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
TOSHIBA KK24 citations92
US6858936B2Feb 22, 2005
Semiconductor device having an improved construction in the interlayer insulating film
TOSHIBA KK15 citations92
US6576554B2Jun 10, 2003
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process
TOSHIBA KK25 citations92
US6312321B1Nov 6, 2001
Polishing apparatus
TOSHIBA KK22 citations92
US6090699AJul 18, 2000
Method of making a semiconductor device
TOSHIBA KK35 citations92
US7419910B2Sep 2, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK12 citations84
US7332104B2Feb 19, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK15 citations84
US7307344B2Dec 11, 2007
Semiconductor device including a discontinuous film and method for manufacturing the same
TOSHIBA KK17 citations84
US7071108B2Jul 4, 2006
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
TOSHIBA KK15 citations84
US6653267B2Nov 25, 2003
Aqueous dispersion for chemical mechanical polishing used for polishing of copper
TOSHIBA KK13 citations84
US7842191B2Nov 30, 2010
CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
TOSHIBA KK7 citations74
US7402521B2Jul 22, 2008
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
TOSHIBA KK8 citations74
US7364667B2Apr 29, 2008
Slurry for CMP and CMP method
TOSHIBA KK5 citations74
US7144804B2Dec 5, 2006
Semiconductor device and method of manufacturing the same
TOSHIBA KK6 citations74
US7138073B2Nov 21, 2006
Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
TOSHIBA KK7 citations74
US7060621B2Jun 13, 2006
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK8 citations74
US6995090B2Feb 7, 2006
Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device
TOSHIBA KK6 citations74
US6896590B2May 24, 2005
CMP slurry and method for manufacturing a semiconductor device
TOSHIBA KK9 citations74
US6790769B2Sep 14, 2004
CMP slurry and method of manufacturing semiconductor device
TOSHIBA KK6 citations74
US6720250B2Apr 13, 2004
Method of manufacturing a semiconductor device using a slurry for chemical mechanical polishing of copper
TOSHIBA KK7 citations74
US6444139B1Sep 3, 2002
Slurry for CMP and CMP method
TOSHIBA KK13 citations74
US8871644B2Oct 28, 2014
Method of manufacturing semiconductor device
TOSHIBA KK4 citations73
US7435682B2Oct 14, 2008
Method of manufacturing semiconductor device
TOSHIBA KK8 citations72
US7833431B2Nov 16, 2010
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
TOSHIBA KK3 citations63
US7700489B2Apr 20, 2010
Method of manufacturing a semiconductor device
TOSHIBA KK4 citations63
US7655559B2Feb 2, 2010
Post-CMP treating liquid and manufacturing method of semiconductor device using the same
TOSHIBA KK5 citations63
US7521350B2Apr 21, 2009
Manufacturing method of a semiconductor device
TOSHIBA KK4 citations63
US7465668B2Dec 16, 2008
Method of manufacturing semiconductor device
TOSHIBA KK3 citations63
US7459398B2Dec 2, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK6 citations63
US7452819B2Nov 18, 2008
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
TOSHIBA KK3 citations63
US7307023B2Dec 11, 2007
Polishing method of Cu film and method for manufacturing semiconductor device
TOSHIBA KK2 citations63
US6984582B2Jan 10, 2006
Method of making semiconductor device by polishing with intermediate clean polishing
TOSHIBA KK5 citations63
US6945854B2Sep 20, 2005
Semiconductor device fabrication method and apparatus
TOSHIBA KK3 citations63
US6897143B2May 24, 2005
Method of manufacturing semiconductor device including two-step polishing operation for cap metal
TOSHIBA KK3 citations63
US7354861B1Apr 8, 2008
Polishing method and polishing liquid
TOSHIBA KK3 citations62
US9144879B2Sep 29, 2015
Planarization method and planarization apparatus
TOSHIBA KK3 citations61
JSR CORP
1 patentFUKUSHIMA DAI
1 patentMINAMIHABA GAKU
1 patentMATSUI YUKITERU
1 patentShowing the top 50 of 63 patents by PatentIndex Score.