Inventor
KANG JOON-SEOK
KR20 patents
⚠️ This page may combine multiple inventors who share the name “KANG JOON-SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
7 patentsUSD626588SNov 2, 2010
Copy machine attached by function of scanner and printer
SAMSUNG ELECTRONICS CO LTD81 citations98
USD629023SDec 14, 2010
Handle for refrigerator
SAMSUNG ELECTRONICS CO LTD26 citations92
USD584347SJan 6, 2009
Laser printer
SAMSUNG ELECTRONICS CO LTD41 citations92
USD572716SJul 8, 2008
Facsimile
SAMSUNG ELECTRONICS CO LTD4 citations63
US10172187B2Jan 1, 2019
Induction heating cooker
SAMSUNG ELECTRONICS CO LTD1 citations62
US9591698B2Mar 7, 2017
Induction heating cooker
SAMSUNG ELECTRONICS CO LTD1 citations51
USD544869SJun 19, 2007
Facsimile machine
SAMSUNG ELECTRONICS CO LTD1 citations51
SAMSUNG ELECTRO MECH
7 patentsUS7632709B2Dec 15, 2009
Method of manufacturing wafer level package
SAMSUNG ELECTRO MECH7 citations73
US6552839B1Apr 22, 2003
Optical switch
SAMSUNG ELECTRO MECH8 citations73
US7113689B2Sep 26, 2006
Microelectromechanical systems (MEMS) variable optical attenuator
SAMSUNG ELECTRO MECH9 citations72
US8026590B2Sep 27, 2011
Die package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations63
US8351215B2Jan 8, 2013
Method of manufacturing a chip embedded printed circuit board
SAMSUNG ELECTRO MECH4 citations62
US7727877B2Jun 1, 2010
Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
SAMSUNG ELECTRO MECH6 citations62
US6833288B2Dec 21, 2004
Dicing method for micro electro mechnical system chip
SAMSUNG ELECTRO MECH4 citations61
KANG JOON SEOK
3 patentsUS8283768B2Oct 9, 2012
Wafer Level package for heat dissipation and method of manufacturing the same
KANG JOON SEOK4 citations61
US8110914B2Feb 7, 2012
Wafer level package with removable chip protecting layer
KANG JOON SEOK4 citations61
US8334602B2Dec 18, 2012
Die package including encapsulated die and method of manufacturing the same
KANG JOON SEOK3 citations60