Inventor
YI SUNG
KR20 patents
⚠️ This page may combine multiple inventors who share the name “YI SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
9 patentsUS7663250B2Feb 16, 2010
Wafer level package and manufacturing method thereof
SAMSUNG ELECTRO MECH26 citations92
US7886414B2Feb 15, 2011
Method of manufacturing capacitor-embedded PCB
SAMSUNG ELECTRO MECH7 citations83
US7730612B2Jun 8, 2010
Method of manufacturing component-embedded printed circuit board
SAMSUNG ELECTRO MECH7 citations73
US7632709B2Dec 15, 2009
Method of manufacturing wafer level package
SAMSUNG ELECTRO MECH7 citations73
US8026590B2Sep 27, 2011
Die package and method of manufacturing the same
SAMSUNG ELECTRO MECH5 citations63
US8351215B2Jan 8, 2013
Method of manufacturing a chip embedded printed circuit board
SAMSUNG ELECTRO MECH4 citations62
US7992296B2Aug 9, 2011
PCB and manufacturing method thereof
SAMSUNG ELECTRO MECH4 citations62
US7982982B2Jul 19, 2011
Wafer level packaging image sensor module having lens actuator and method of manufacturing the same
SAMSUNG ELECTRO MECH2 citations62
US7727877B2Jun 1, 2010
Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar
SAMSUNG ELECTRO MECH6 citations62