P

Inventor

DOH JAE-CHEON

KR11 patents
⚠️ This page may combine multiple inventors who share the name “DOH JAE-CHEON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

4 patents
US7696004B2Apr 13, 2010

Wafer level package fabrication method

SAMSUNG ELECTRO MECH23 citations90
US9510461B2Nov 29, 2016

Electric component module and method of manufacturing the same

SAMSUNG ELECTRO MECH6 citations69
US7670878B2Mar 2, 2010

Method for manufacturing semiconductor package

SAMSUNG ELECTRO MECH2 citations60
US9048199B2Jun 2, 2015

Semiconductor package and method of manufacturing the semiconductor package

SAMSUNG ELECTRO MECH0 citations40

SAMSUNG ELECTRONICS CO LTD

4 patents
US7484901B2Feb 3, 2009

Image sensor camera module and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD8 citations83
US7659936B2Feb 9, 2010

Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD6 citations71
US7683476B2Mar 23, 2010

Semiconductor package film having reinforcing member and related display module

SAMSUNG ELECTRONICS CO LTD1 citations51
US8054370B2Nov 8, 2011

Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD1 citations50

KIM TAE HOON

1 patent
US8842438B2Sep 23, 2014

3D power module package

KIM TAE HOON6 citations72

LEE SEUNG SEOUP

1 patent
US8410465B2Apr 2, 2013

Apparatus and method for inspecting defects of a circuit pattern formed on a substrate using a laser and a non-contact capacitor sensor

LEE SEUNG SEOUP3 citations59

KANG JOON-SEOK

1 patent
US8779580B2Jul 15, 2014

Electronic component package and manufacturing method thereof

KANG JOON-SEOK0 citations46