Inventor
EDELSTEIN DANIEL
US4 patents
Patents
4 patentsUS10643890B2May 5, 2020
Ultrathin multilayer metal alloy liner for nano Cu interconnects
IBM3 citations72
US11177167B2Nov 16, 2021
Ultrathin multilayer metal alloy liner for nano Cu interconnects
IBM0 citations61
US7955971B2Jun 7, 2011
Hybrid metallic wire and methods of fabricating same
IBM4 citations61
US9589894B2Mar 7, 2017
Copper interconnect structure and its formation
IBM0 citations46