Inventor
YOO DO-JAE
KR32 patents
⚠️ This page may combine multiple inventors who share the name “YOO DO-JAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
26 patentsUS7642656B2Jan 5, 2010
Semiconductor package and method for manufacturing thereof
SAMSUNG ELECTRO MECH15 citations90
US9748179B2Aug 29, 2017
Package and method of manufacturing the same
SAMSUNG ELECTRO MECH8 citations84
US9496219B2Nov 15, 2016
Semiconductor package including an antenna formed in a groove within a sealing element
SAMSUNG ELECTRO MECH8 citations84
US9209114B2Dec 8, 2015
Power module package with a fastening unit including a non-conductive portion
SAMSUNG ELECTRO MECH7 citations84
US9633923B2Apr 25, 2017
Electronic device module and manufacturing method thereof
SAMSUNG ELECTRO MECH4 citations73
US9585260B2Feb 28, 2017
Electronic component module and manufacturing method thereof
SAMSUNG ELECTRO MECH2 citations73
US9202798B2Dec 1, 2015
Power module package and method for manufacturing the same
SAMSUNG ELECTRO MECH5 citations73
US9076660B2Jul 7, 2015
Power module package
SAMSUNG ELECTRO MECH6 citations73
USD708578SJul 8, 2014
Terminal pin
SAMSUNG ELECTRO MECH5 citations73
US7875983B2Jan 25, 2011
Semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US7875497B2Jan 25, 2011
Method of manufacturing a semiconductor package
SAMSUNG ELECTRO MECH6 citations73
US10163746B2Dec 25, 2018
Semiconductor package with improved signal stability and method of manufacturing the same
SAMSUNG ELECTRO MECH3 citations71
USD708139SJul 1, 2014
Terminal pin
SAMSUNG ELECTRO MECH2 citations63
US10219380B2Feb 26, 2019
Electronic device module and manufacturing method thereof
SAMSUNG ELECTRO MECH1 citations62
US11387270B2Jul 12, 2022
Image sensor package including reflector
SAMSUNG ELECTRO MECH0 citations60
US12453012B2Oct 21, 2025
Printed circuit board and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations59
US12262477B2Mar 25, 2025
Reprint apparatus for circuit board and reprint method using the same
SAMSUNG ELECTRO MECH0 citations57
US10667419B2May 26, 2020
Manufacturing method of an electronic component module
SAMSUNG ELECTRO MECH0 citations52
US9894790B2Feb 13, 2018
Electronic component module and manufacturing method thereof
SAMSUNG ELECTRO MECH0 citations52
US9508565B2Nov 29, 2016
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations52
US9343391B2May 17, 2016
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRO MECH1 citations52
US9105601B2Aug 11, 2015
Power module package
SAMSUNG ELECTRO MECH0 citations52
US10109595B2Oct 23, 2018
Double-sided package module and substrate strip
SAMSUNG ELECTRO MECH0 citations49
US9123683B2Sep 1, 2015
Unit power module and power module package comprising the same
SAMSUNG ELECTRO MECH0 citations42
US10356911B2Jul 16, 2019
Electronic device module and method of manufacturing the same
SAMSUNG ELECTRO MECH0 citations41
US9048199B2Jun 2, 2015
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRO MECH0 citations40