Inventor

BAEK JONG-HWAN

KR7 patents

⚠️ This page may combine multiple inventors who share the name “BAEK JONG-HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRO MECH

4 patents

US7663250B2Feb 16, 2010

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

SAMSUNG ELECTRO MECH6 citations62

PARK SEUNG WOOK

1 patent

US8143099B2Mar 27, 2012

Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer

PARK SEUNG WOOK8 citations83

SAMSUNG LED CO LTD

1 patent

US7846754B2Dec 7, 2010

High power light emitting diode package and method of producing the same

SAMSUNG LED CO LTD4 citations61

KANG JOON-SEOK

1 patent

US8779580B2Jul 15, 2014

Electronic component package and manufacturing method thereof

KANG JOON-SEOK0 citations46

BAEK JONG-HWAN

SAMSUNG ELECTRO MECH

Wafer level package and manufacturing method thereof

High power light emitting diode package and method of producing the same

Surface mounting device-type light emitting diode

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

PARK SEUNG WOOK

Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer

SAMSUNG LED CO LTD

High power light emitting diode package and method of producing the same

KANG JOON-SEOK

Electronic component package and manufacturing method thereof