Inventor

CHIU SHENG-HSIANG

TW24 patents

⚠️ This page may combine multiple inventors who share the name “CHIU SHENG-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIU SHENG-HSIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Lid design for heat dissipation enhancement of die package

Package-on-package structure and method

Package structure and method for forming the same

Semiconductor device having antenna on chip package and manufacturing method thereof

Semiconductor device having antenna and manufacturing method thereof

Integrated fan-out package and manufacturing method thereof

Molded semiconductor device and manufacturing method of molded semiconductor device

Semiconductor device having antenna and manufacturing method thereof

Molding apparatus and manufacturing method of molded semiconductor device

Advanced info POP and method of forming thereof

Molding apparatus and manufacturing method of molded semiconductor device

Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device

Advanced INFO POP and method of forming thereof

Method of fabricating memory device and package structure

Three-dimensional integrated circuit structures and methods of forming the same

Package structure

Memory device, package structure and fabricating method thereof

Three-dimensional integrated circuit structures and methods of forming the same

Package-on-package structure and method

Semiconductor package and manufacturing method thereof

Package structure and manufacturing method thereof

PRIMAX ELECTRONICS LTD

Miniature image pickup module and manufacturing method thereof

Lens module

TAIWAN SEMICONDUCTOR MFG

Methods of dicing a semiconductor structure