P

Inventor

WAN ALBERT

TW35 patents
⚠️ This page may combine multiple inventors who share the name “WAN ALBERT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

24 patents
US10490479B1Nov 26, 2019

Packaging of semiconductor device with antenna and heat spreader

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US10186492B1Jan 22, 2019

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD16 citations94
US10157807B2Dec 18, 2018

Sensor packages and manufacturing mehtods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations92
US11335655B2May 17, 2022

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10636713B2Apr 28, 2020

Semiconductor packages and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10366966B1Jul 30, 2019

Method of manufacturing integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US11855333B2Dec 26, 2023

Semiconductor packages and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11705409B2Jul 18, 2023

Semiconductor device having antenna on chip package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10978782B2Apr 13, 2021

Semiconductor packages and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10872842B2Dec 22, 2020

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10741508B2Aug 11, 2020

Semiconductor device having antenna and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10475757B2Nov 12, 2019

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10381309B2Aug 13, 2019

Package structure having connecting module

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10756052B2Aug 25, 2020

Method of manufacturing integrated fan-out package

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US12266847B2Apr 1, 2025

Semiconductor packages and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12057415B2Aug 6, 2024

Semiconductor device having antenna and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11515618B2Nov 29, 2022

Semiconductor packages and manufacturing methods thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11282810B2Mar 22, 2022

Integrated fan-out package and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10867882B2Dec 15, 2020

Semiconductor package, semiconductor device and method for packaging semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867940B2Dec 15, 2020

Package structure and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10183858B2Jan 22, 2019

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10157859B2Dec 18, 2018

Semiconductor device structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9875972B1Jan 23, 2018

Semiconductor device structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10879197B2Dec 29, 2020

Package structure and method of fabricating package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42

FEE TAT PLASTIC FACTORY LTD

8 patents

ANDIS CO

2 patents

NAT UNIV SINGAPORE

1 patent