Inventor

MUZZY CHRISTOPHER D

US118 patents

⚠️ This page may combine multiple inventors who share the name “MUZZY CHRISTOPHER D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MUZZY CHRISTOPHER D

IBM

Electrical interconnection structure formation

Conductive pillar shaped for solder confinement

Undercut-free BLM process for Pb-free and Pb-reduced C4

Undercut-free BLM process for Pb-free and Pb-reduced C4

Solder bumps in flip-chip technologies

Damascene patterning of barrier layer metal for C4 solder bumps

Chip dicing

Chip dicing

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Structures to enable a full intermetallic interconnect

Nanowires for pillar interconnects

Conductive pillar shaped for solder confinement

Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip

IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods

Structures and methods for improving solder bump connections in semiconductor devices

Method for forming C4 connections on integrated circuit chips and the resulting devices

Wire and solder bond forming methods

Damascene patterning of barrier layer metal for C4 solder bumps

Prevention of backside cracks in semiconductor chips or wafers using backside film or backside wet etch

Chip dicing

Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package

Method of forming a crack stop void in a low-k dielectric layer between adjacent fuses

Methods of forming solder connections and structure thereof

Conductive pillar shaped for solder confinement

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Conductive pillar shaped for solder confinement

Determining crackstop strength of integrated circuit assembly at the wafer level

Capacitor using barrier layer metallurgy

Plug via formation by patterned plating and polishing

Solder bump connection and method of making

Far back end of the line metallization method and structures

Thermal via for 3D integrated circuits structures

Fine pitch solder bump structure with built-in stress buffer

Optoelectronic memory devices

Structure and programming of laser fuse

Lead-free solder joining of electronic structures

DAUBENSPECK TIMOTHY H

Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop

Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump

Ni plating of a BLM edge for Pb-free C4 undercut control

Structures and methods to improve lead-free C4 interconnect reliability

Underfill flow guide structures

Chip package solder interconnect formed by surface tension

Solder bump connections

GLOBALFOUNDRIES INC

Barrier structures for underfill blockout regions

Passivation layer topography

Photonics chip

ARVIN CHARLES L

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof