P

Inventor

SHIOMI YUTAKA

JP32 patents
⚠️ This page may combine multiple inventors who share the name “SHIOMI YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUMITOMO CHEMICAL CO

23 patents
US4808717AFeb 28, 1989

Thermosetting resin composition

SUMITOMO CHEMICAL CO30 citations92
US5478871ADec 26, 1995

Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same

SUMITOMO CHEMICAL CO27 citations91
US5583635ADec 10, 1996

Method of measuring particles and apparatus for the same

SUMITOMO CHEMICAL CO36 citations90
US5644003AJul 1, 1997

Epoxy resin composition, process for producing the same and resin-sealed semiconductor device

SUMITOMO CHEMICAL CO18 citations84
US4980436ADec 25, 1990

Thermosetting resin composition from alkenyl aryloxy triazine compound and poly maleimide

SUMITOMO CHEMICAL CO19 citations82
US4960860AOct 2, 1990

Imide compound and composition containing the same

SUMITOMO CHEMICAL CO17 citations82
US4855339AAug 8, 1989

Epoxy resin composition

SUMITOMO CHEMICAL CO20 citations81
US4913697AApr 3, 1990

Thermosetting resin composition from alkenylaryloxy triazine

SUMITOMO CHEMICAL CO8 citations74
US5780145AJul 14, 1998

Filler-containing resin composition suitable for injection molding and transfer molding

SUMITOMO CHEMICAL CO8 citations73
US5719225AFeb 17, 1998

Filler-containing resin composition suitable for injection molding and transfer molding

SUMITOMO CHEMICAL CO15 citations73
US5326881AJul 5, 1994

Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor

SUMITOMO CHEMICAL CO5 citations73
US5258719ANov 2, 1993

Capacitive coagulation detecting device for mixed phase container

SUMITOMO CHEMICAL CO16 citations73
US5252687AOct 12, 1993

Thermosetting resin composition and use thereof for an electronic part

SUMITOMO CHEMICAL CO18 citations73
US5551297ASep 3, 1996

Pipe clogging detecting device

SUMITOMO CHEMICAL CO10 citations72
US4888407ADec 19, 1989

Imide compound and composition containing the same

SUMITOMO CHEMICAL CO8 citations71
US5750789AMay 12, 1998

Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor

SUMITOMO CHEMICAL CO2 citations62
US5646204AJul 8, 1997

Epoxy resin composition and resin-encapsulated semiconductor device

SUMITOMO CHEMICAL CO5 citations62
US5395912AMar 7, 1995

Polyhydric phenol and epoxy resin and epoxy resin composition derived therefrom

SUMITOMO CHEMICAL CO1 citations62
US4908417AMar 13, 1990

Thermosetting resin composition

SUMITOMO CHEMICAL CO4 citations61
US5560968AOct 1, 1996

Semiconductor device encapsulated with an epoxy resin and a process for encapsulation

SUMITOMO CHEMICAL CO0 citations52
US5498687AMar 12, 1996

Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor

SUMITOMO CHEMICAL CO0 citations52
US5462997AOct 31, 1995

Polyhydric phenol, and epoxy resin and epoxy resin composition derived therefrom

SUMITOMO CHEMICAL CO0 citations52
US5444165AAug 22, 1995

Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor

SUMITOMO CHEMICAL CO0 citations52

SHARP KK

4 patents

DAISO CO LTD

4 patents

SASAKURA ENG CO LTD

1 patent