Inventor
SHU WILLIAM K
US5 patents
Patents
5 patentsUS5598031AJan 28, 1997
Electrically and thermally enhanced package using a separate silicon substrate
VLSI TECHNOLOGY INC81 citations94
US6037669AMar 14, 2000
Staggered pad array
VLSI TECHNOLOGY INC23 citations91
US5525839AJun 11, 1996
Method of packing an IC die in a molded plastic employing an ultra-thin die coating process
VLSI TECHNOLOGY INC20 citations90
US5675179AOct 7, 1997
Universal test die and method for fine pad pitch designs
VLSI TECHNOLOGY INC23 citations89
US5153507AOct 6, 1992
Multi-purpose bond pad test die
VLSI TECHNOLOGY INC48 citations89