Inventor

FUERGUT EDWARD

DE141 patents

⚠️ This page may combine multiple inventors who share the name “FUERGUT EDWARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUERGUT EDWARD

INFINEON TECHNOLOGIES AG

Thinning in package using separation structure as stop

Apparatus comprising and a method for manufacturing an embedded MEMS device

Semiconductor device with a wiring substrate and method for producing the same

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Semiconductor device including electronic component coupled to a backside of a chip

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Method for producing through-contacts and a semiconductor component with through-contacts

Reconfigured wafer alignment

Smart card, smart card module, and a method for production of a smart card module

Electronic component and semiconductor wafer, and method for producing the same

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Semiconductor device including a dielectric material

Composite board with semiconductor chips and plastic housing composition and method

Semiconductor structure with a plastic housing and separable carrier plate

System and method for packaged MEMS device having embedding arrangement, MEMS die, and grille

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Method of manufacturing a semiconductor device including etching to etch stop regions

Semiconductor device having an adhesion promoting layer and method for producing it

Producing thin integrated semiconductor devices

Semiconductor stack block comprising semiconductor chips and methods for producing the same

Electronic device

Spatially selective roughening of encapsulant to promote adhesion with functional structure

Embedded chip package, a chip package, and a method for manufacturing an embedded chip package

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement

Electronic device package including metal blocks

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Method for fabricating a semiconductor chip panel

Method for fabricating a semiconductor chip panel

Package with electrically insulated carrier and at least one step on encapsulant

Method for producing a semiconductor module

Electronic device package having a dielectric layer and an encapsulant

Arrangement and method for manufacturing the same

Arrangement having a plurality of chips and a chip carrier, and a processing arrangement

INFINEON TECHNOLOGIES AUSTRIA AG

Electronic module comprising a plurality of encapsulation layers and a method for producing it

Semiconductor power package and method of manufacturing the same

Functionalized interface structure

Power device with overvoltage arrester

Method of manufacturing a package having a power semiconductor chip

Method of manufacturing a semiconductor power package

Semiconductor package with connection lug

Semiconductor devices with improved thermal and electrical performance

Semiconductor device having die pads with exposed surfaces

FUERGUT EDWARD

Apparatus comprising and a method for manufacturing an embedded MEMS device

Semiconductor package and methods of formation thereof

MAHLER JOACHIM

Electric device package comprising a laminate and method of making an electric device package comprising a laminate

Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package

BAUER MICHAEL

Semiconductor device having a semiconductor chip, and method for the production thereof

NIKITIN IVAN

Semiconductor package and methods of formation thereof