Inventor

BEER GOTTFRIED

DE87 patents

⚠️ This page may combine multiple inventors who share the name “BEER GOTTFRIED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BEER GOTTFRIED

INFINEON TECHNOLOGIES AG

Semiconductor device having a plastic housing and external connections and method for producing the same

Semiconductor packages with integrated antenna and method of forming thereof

Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same

Insulated die

Semiconductor device with hollow structure

Semiconductor device

Stacked semiconductor chips

Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof

Device and method for data transmission between structural units connected by an articulated joint

Photo-acoustic gas sensor module having light emitter and detector units

On-chip RF shields with backside redistribution lines

Flexible rewiring plate for semiconductor components, and process for producing it

Method of manufacturing and testing a chip package

Electronic component having a semiconductor chip, system carrier, and methods for producing the electronic component and the semiconductor chip

Method of manufacturing an inductor core for a chip assembly and chip assembly

Embedded chip packages and methods for manufacturing an embedded chip package

Embedded chip packages and methods for manufacturing an embedded chip package

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Semiconductor device having a chip under package

Semiconductor package comprising two semiconductor modules and laterally extending connectors

Semiconductor module including components in plastic casing

Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip

Microelectromechanical semiconductor component with cavity structure and method for producing the same

Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Semiconductor device having solderable and bondable electrical contact pads

Method for fabricating a plurality of semiconductor devices

BEER GOTTFRIED

Semiconductor packages with integrated antenna and methods of forming thereof

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Method of manufacturing a semiconductor structure

System and method for a coreless transformer

Method for fabricating a semiconductor and semiconductor package

Heat treatment for a panel and apparatus for carrying out the heat treatment method

PRESSEL KLAUS

Embedded chip package

Semiconductor device and manufacturing method

Semiconductor device and manufacturing method

BARTH HANS-JOACHIM

On-chip RF shields with through substrate conductors

Semiconductor structure and method for making same

On-chip RF shields with backside redistribution lines

SIEMENS AG

Component housing for surface mounting of a semiconductor component

Semiconductor device

INTEL DEUTSCHLAND GMBH

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

EZCONN CORP

Optical transmitter and/or receiver assembly comprising a planar optical circuit

THEUSS HORST

Semiconductor device with hollow structure

HOSSEINI KHALIL

Electronic device and method of fabricating an electronic device

BRUNNBAUER MARKUS

Stacked semiconductor chips

FUERGUT EDWARD

Method for manufacturing an electronic module and an electronic module