Inventor

HOHLFELD OLAF

DE40 patents

⚠️ This page may combine multiple inventors who share the name “HOHLFELD OLAF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HOHLFELD OLAF

INFINEON TECHNOLOGIES AG

Semiconductor device including cladded base plate

Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same

Module including a rough solder joint

Semiconductor module and method for producing the same

Semiconductor module and method for producing the same

Semiconductor arrangement, method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Semiconductor package comprising two semiconductor modules and laterally extending connectors

Electronic device package having a dielectric layer and an encapsulant

Power semiconductor module arrangement

Method for producing a semiconductor arrangement

Semiconductor arrangement and method for producing the same

Method for producing power semiconductor module arrangement

Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module

Power semiconductor module arrangement

Power semiconductor module and method for fabricating the same

Explosion-protected semiconductor module

Method for producing a substrate

Method for producing a number of chip assemblies and method for producing a semiconductor arrangement

Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material

Semiconductor module, semiconductor module arrangement and method for operating a semiconductor module

Semiconductor module comprising printed circuit board and method for producing a semiconductor module comprising a printed circuit board

Semiconductor module and a method for fabrication thereof by extended embedding technologies

Method for producing a power semiconductor module

Spring contact for semiconductor chip

Explosion-protected semiconductor module

Chip assemblage, press pack cell and method for operating a press pack cell

Semiconductor arrangement, method for producing a number of chip assemblies, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Semiconductor arrangement, method for producing a semiconductor module, method for producing a semiconductor arrangement and method for operating a semiconductor arrangement

Semiconductor assembly comprising chip arrays

HOHLFELD OLAF

Semiconductor module comprising an insert

Twist-secured assembly of a power semiconductor module mountable on a heat sink

Method for fabricating a circuit substrate assembly and a power electronics module comprising an anchoring structure for producing a changing temperature-stable solder bond

BAYERER REINHOLD

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

Method for producing a composite and a power semiconductor module

INFINEON TECHNOLOGIES AUSTRIA AG

Power module with metal substrate

Power module with metal substrate

STOLZE THILO

Power semiconductor module including substrates spaced from each other

KANSCHAT PETER

Power semiconductor module featuring resiliently supported substrates and method for fabricating a power semiconductor module

LENNIGER ANDREAS

Semiconductor device including cladded base plate