Inventor
ODA NORIAKI
JP52 patents
⚠️ This page may combine multiple inventors who share the name “ODA NORIAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
31 patentsUS6503826B1Jan 7, 2003
Semiconductor device and method for manufacturing the same
NEC CORP538 citations99
US6091121AJul 18, 2000
Semiconductor device and method for manufacturing the same
NEC CORP56 citations96
US6091081AJul 18, 2000
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film
NEC CORP55 citations96
US5994749ANov 30, 1999
Semiconductor device having a gate electrode film containing nitrogen
NEC CORP74 citations96
US5930667AJul 27, 1999
Method for fabricating multilevel interconnection structure for semiconductor devices
NEC CORP67 citations96
US6316833B1Nov 13, 2001
Semiconductor device with multilayer interconnection having HSQ film with implanted fluorine and fluorine preventing liner
NEC CORP33 citations93
US6288430B1Sep 11, 2001
Semiconductor device having silicide layer with siliconrich region and method for making the same
NEC CORP17 citations93
US6187662B1Feb 13, 2001
Semiconductor device with low permittivity interlayer insulating film and method of manufacturing the same
NEC CORP25 citations93
US6060784AMay 9, 2000
Interconnection layer structure in a semiconductor integrated circuit device having macro cell regions
NEC CORP23 citations93
US5883433AMar 16, 1999
Semiconductor device having a critical path wiring
NEC CORP22 citations93
US5793113AAug 11, 1998
Multilevel interconnection structure for semiconductor devices
NEC CORP30 citations93
US5472890ADec 5, 1995
Method for fabricating an insulating gate field effect transistor
NEC CORP40 citations93
US5416359AMay 16, 1995
Semiconductor device having gold wiring layer provided with a barrier metal layer
NEC CORP22 citations93
US6633082B1Oct 14, 2003
Semiconductor device and method for manufacturing the semiconductor device
NEC CORP18 citations84
US6531779B1Mar 11, 2003
Multi-layer interconnection structure in semiconductor device and method for fabricating same
NEC CORP14 citations84
US6505332B1Jan 7, 2003
Method and apparatus for generating logic cell library and method and apparatus for wiring layout using the same
NEC CORP20 citations84
US5479053ADec 26, 1995
Semiconductor device with conductor clad insulator wiring
NEC CORP19 citations82
US6358802B1Mar 19, 2002
Method for manufacturing semiconductor device having a gate electrode film containing nitrogen
NEC CORP9 citations74
US5990003ANov 23, 1999
Method of fabricating a semiconductor device
NEC CORP11 citations74
US5990001ANov 23, 1999
Method of forming a semiconductor device having a critical path wiring
NEC CORP12 citations74
US5985750ANov 16, 1999
Manufacturing method of semiconductor device
NEC CORP9 citations74
US5976962ANov 2, 1999
Method of fabricating semiconductor device
NEC CORP5 citations74
US5750437AMay 12, 1998
Method of fabricating semiconductor device
NEC CORP11 citations74
US5592023AJan 7, 1997
Semiconductor device
NEC CORP15 citations74
US5502335AMar 26, 1996
Semiconductor device with wiring layer
NEC CORP18 citations74
US6372628B1Apr 16, 2002
Insulating film comprising amorphous carbon fluoride, a semiconductor device comprising such an insulating film, and a method for manufacturing the semiconductor device
NEC CORP11 citations73
US6492264B2Dec 10, 2002
Semiconductor device having a silicide layer with silicon-rich region and method for making the same
NEC CORP2 citations63
US6313036B1Nov 6, 2001
Method for producing semiconductor device
NEC CORP4 citations63
US6274476B1Aug 14, 2001
Semiconductor device and method of manufacturing the same
NEC CORP4 citations63
US6211062B1Apr 3, 2001
Method for manufacturing semiconductor device having multiple wiring layer
NEC CORP3 citations63
US5955384ASep 21, 1999
Method of fabricating semiconductor device
NEC CORP2 citations63
NEC ELECTRONICS CORP
14 patentsUS7397125B2Jul 8, 2008
Semiconductor device with bonding pad support structure
NEC ELECTRONICS CORP23 citations93
US7312535B2Dec 25, 2007
Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
NEC ELECTRONICS CORP26 citations92
US7327031B2Feb 5, 2008
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP9 citations84
US7846830B2Dec 7, 2010
Semiconductor device and method for manufacturing same
NEC ELECTRONICS CORP11 citations83
US7692265B2Apr 6, 2010
Fuse and seal ring
NEC ELECTRONICS CORP7 citations74
US6756676B2Jun 29, 2004
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP6 citations74
US6559542B1May 6, 2003
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP7 citations74
US7230337B2Jun 12, 2007
Semiconductor device including ladder-shaped siloxane hydride and method for manufacturing same
NEC ELECTRONICS CORP9 citations73
US7508082B2Mar 24, 2009
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP3 citations63
US6821687B2Nov 23, 2004
Photo mask for fabricating semiconductor device having dual damascene structure
NEC ELECTRONICS CORP5 citations61
US7763968B2Jul 27, 2010
Semiconductor device featuring large reinforcing elements in pad area
NEC ELECTRONICS CORP0 citations52
US7714449B2May 11, 2010
Semiconductor device with bonding pad support structure
NEC ELECTRONICS CORP0 citations52
US7432545B2Oct 7, 2008
Semiconductor device
NEC ELECTRONICS CORP1 citations52
US6777324B2Aug 17, 2004
Multi-layer interconnection structure in semiconductor device and method for fabricating same
NEC ELECTRONICS CORP0 citations52
ODA NORIAKI
3 patentsSANDISK TECHNOLOGIES LLC
2 patentsUS11450624B2Sep 20, 2022
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
SANDISK TECHNOLOGIES LLC2 citations72
US11444039B2Sep 13, 2022
Semiconductor die including diffusion barrier layers embedding bonding pads and methods of forming the same
SANDISK TECHNOLOGIES LLC2 citations72
Showing the top 50 of 52 patents by PatentIndex Score.