Inventor
TORIHATA MINORU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “TORIHATA MINORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKAWA KK
25 patentsUS6036080AMar 14, 2000
Wire bonding method
SHINKAWA KK20 citations92
US5988481ANov 23, 1999
Bonding apparatus with adjustable heating blocks, clamps, and rails
SHINKAWA KK21 citations92
US5906308AMay 25, 1999
Capillary for use in a wire bonding apparatus
SHINKAWA KK23 citations92
US5884830AMar 23, 1999
Capillary for a wire bonding apparatus
SHINKAWA KK24 citations92
US5562396AOct 8, 1996
Non-contact type moving table
SHINKAWA KK32 citations92
US5439341AAug 8, 1995
Non-contact type moving table
SHINKAWA KK23 citations92
US5323948AJun 28, 1994
Wire clamper
SHINKAWA KK24 citations92
US5746422AMay 5, 1998
Clamping device
SHINKAWA KK35 citations91
US5435477AJul 25, 1995
Wire clampers
SHINKAWA KK27 citations90
US5259548ANov 9, 1993
Wire bonding method
SHINKAWA KK11 citations74
US6145651ANov 14, 2000
Guide rail mechanism for a bonding apparatus
SHINKAWA KK9 citations73
US6135270AOct 24, 2000
Guide rail mechanism for a bonding apparatus
SHINKAWA KK9 citations73
US5564616AOct 15, 1996
Wire bonding apparatus
SHINKAWA KK8 citations73
US5562395AOct 8, 1996
Non-contact type moving table
SHINKAWA KK10 citations73
US5501569AMar 26, 1996
Non-contact type moving table
SHINKAWA KK7 citations73
US5431527AJul 11, 1995
Non-contact type moving table system
SHINKAWA KK8 citations73
US5275324AJan 4, 1994
Wire bonding apparatus
SHINKAWA KK16 citations71
US5340010AAug 23, 1994
Bonding apparatus
SHINKAWA KK5 citations63
US5234155AAug 10, 1993
Wire bonding method and apparatus
SHINKAWA KK6 citations63
US5157985AOct 27, 1992
X-Y table for bonding devices
SHINKAWA KK4 citations63
US5046655ASep 10, 1991
Device for detecting height of bonding surface
SHINKAWA KK4 citations62
US6089439AJul 18, 2000
Wire cutting and feeding device for use in wire bonding apparatus
SHINKAWA KK5 citations61
US6727666B2Apr 27, 2004
XY table for a semiconductor manufacturing apparatus
SHINKAWA KK5 citations58
US5261777ANov 16, 1993
Pushing device
SHINKAWA KK0 citations52
US6024271AFeb 15, 2000
Wire bonding apparatus
SHINKAWA KK0 citations46