Inventor
GRUBER PETER ALFRED
US27 patents
⚠️ This page may combine multiple inventors who share the name “GRUBER PETER ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
24 patentsUS5673846AOct 7, 1997
Solder anchor decal and method
IBM135 citations99
US5775569AJul 7, 1998
Method for building interconnect structures by injection molded solder and structures built
IBM120 citations98
US6332569B1Dec 25, 2001
Etched glass solder bump transfer for flip chip integrated circuit devices
IBM97 citations97
US6527158B1Mar 4, 2003
Method and apparatus for forming solder bumps
IBM60 citations95
US6452117B2Sep 17, 2002
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
IBM76 citations95
US6231333B1May 15, 2001
Apparatus and method for vacuum injection molding
IBM119 citations95
US6149122ANov 21, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM61 citations95
US6133633AOct 17, 2000
Method for building interconnect structures by injection molded solder and structures built
IBM40 citations95
US6105852AAug 22, 2000
Etched glass solder bump transfer for flip chip integrated circuit devices
IBM73 citations95
US6056191AMay 2, 2000
Method and apparatus for forming solder bumps
IBM83 citations95
US6390439B1May 21, 2002
Hybrid molds for molten solder screening process
IBM44 citations94
US6003757ADec 21, 1999
Apparatus for transferring solder bumps and method of using
IBM81 citations93
US6708872B2Mar 23, 2004
Method and apparatus for applying solder to an element on a substrate
IBM22 citations92
US6425518B1Jul 30, 2002
Method and apparatus for applying solder to an element on a substrate
IBM28 citations92
US6394334B1May 28, 2002
Method and apparatus for forming solder bumps
IBM24 citations92
US6294745B1Sep 25, 2001
Solder anchor decal
IBM38 citations92
US6153505ANov 28, 2000
Plastic solder array using injection molded solder
IBM46 citations92
US6029882AFeb 29, 2000
Plastic solder array using injection molded solder
IBM38 citations92
US6832747B2Dec 21, 2004
Hybrid molds for molten solder screening process
IBM18 citations91
US6581280B2Jun 24, 2003
Method for filling high aspect ratio via holes in electronic substrates
IBM40 citations91
US6340630B1Jan 22, 2002
Method for making interconnect for low temperature chip attachment
IBM28 citations91
US6127735AOct 3, 2000
Interconnect for low temperature chip attachment
IBM41 citations91
US7906420B2Mar 15, 2011
Method and apparatus for forming planar alloy deposits on a substrate
IBM5 citations63
US7867842B2Jan 11, 2011
Method and apparatus for forming planar alloy deposits on a substrate
IBM3 citations63