Inventor
LEI CHON CHEONG
US9 patents
Patents
9 patentsUS6569252B1May 27, 2003
Semi-aqueous solvent cleaning of paste processing residue from substrates
IBM44 citations96
US6708872B2Mar 23, 2004
Method and apparatus for applying solder to an element on a substrate
IBM22 citations92
US6425518B1Jul 30, 2002
Method and apparatus for applying solder to an element on a substrate
IBM28 citations92
US6153505ANov 28, 2000
Plastic solder array using injection molded solder
IBM46 citations92
US6029882AFeb 29, 2000
Plastic solder array using injection molded solder
IBM38 citations92
US5913985AJun 22, 1999
Fixture and method for securing electronic modules during wet processing
IBM8 citations72
US6742530B2Jun 1, 2004
Semi-aqueous solvent cleaning of paste processing residue from substrates
IBM2 citations62
US6910615B2Jun 28, 2005
Solder reflow type electrical apparatus packaging having integrated circuit and discrete components
IBM2 citations59
US6016947AJan 25, 2000
Non-destructive low melt test for off-composition solder
IBM6 citations57