Inventor
SARDESAI VIRAJ Y
US41 patents
⚠️ This page may combine multiple inventors who share the name “SARDESAI VIRAJ Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
32 patentsUS6268299B1Jul 31, 2001
Variable stoichiometry silicon nitride barrier films for tunable etch selectivity and enhanced hyrogen permeability
IBM78 citations96
US6117778ASep 12, 2000
Semiconductor wafer edge bead removal method and tool
IBM60 citations95
US9496362B1Nov 15, 2016
Contact first replacement metal gate
IBM20 citations93
US9111962B1Aug 18, 2015
Selective dielectric spacer deposition for exposing sidewalls of a finFET
IBM18 citations92
US8643122B2Feb 4, 2014
Silicide contacts having different shapes on regions of a semiconductor device
IBM26 citations92
US8603881B1Dec 10, 2013
Raised trench metal semiconductor alloy formation
IBM19 citations92
US6497784B1Dec 24, 2002
Semiconductor wafer edge bead removal method and tool
IBM20 citations92
US6057220AMay 2, 2000
Titanium polycide stabilization with a porous barrier
IBM36 citations92
US9349836B2May 24, 2016
Fin end spacer for preventing merger of raised active regions
IBM6 citations84
US9105614B2Aug 11, 2015
Local interconnects compatible with replacement gate structures
IBM6 citations84
US8815693B2Aug 26, 2014
FinFET device formation
IBM13 citations84
US8796099B2Aug 5, 2014
Inducing channel strain via encapsulated silicide formation
IBM7 citations84
US10262996B2Apr 16, 2019
Third type of metal gate stack for CMOS devices
IBM1 citations73
US9985104B2May 29, 2018
Contact first replacement metal gate
IBM2 citations73
US9263457B2Feb 16, 2016
Cross-coupling of gate conductor line and active region in semiconductor devices
IBM4 citations73
US9059290B2Jun 16, 2015
FinFET device formation
IBM4 citations73
US9496368B2Nov 15, 2016
Partial spacer for increasing self aligned contact process margins
IBM2 citations63
US9331166B2May 3, 2016
Selective dielectric spacer deposition for exposing sidewalls of a finFET
IBM2 citations62
US10741554B2Aug 11, 2020
Third type of metal gate stack for CMOS devices
IBM0 citations52
US10083865B2Sep 25, 2018
Partial spacer for increasing self aligned contact process margins
IBM0 citations52
US9929047B2Mar 27, 2018
Partial spacer for increasing self aligned contact process margins
IBM0 citations52
US9679993B2Jun 13, 2017
Fin end spacer for preventing merger of raised active regions
IBM0 citations52
US9634006B2Apr 25, 2017
Third type of metal gate stack for CMOS devices
IBM0 citations52
US9601380B2Mar 21, 2017
Fin end spacer for preventing merger of raised active regions
IBM0 citations52
US9553157B2Jan 24, 2017
Diffusion-controlled oxygen depletion of semiconductor contact interface
IBM0 citations52
US9515168B2Dec 6, 2016
Fin end spacer for preventing merger of raised active regions
IBM0 citations52
US9397181B2Jul 19, 2016
Diffusion-controlled oxygen depletion of semiconductor contact interface
IBM1 citations52
US9391175B2Jul 12, 2016
Fin end spacer for preventing merger of raised active regions
IBM0 citations52
US9318323B2Apr 19, 2016
Semiconductor devices with graphene nanoribbons
IBM0 citations52
US9171800B2Oct 27, 2015
Electrical fuse with bottom contacts
IBM0 citations52
US8039888B2Oct 18, 2011
Conductive spacers for semiconductor devices and methods of forming
IBM0 citations51
US9472415B2Oct 18, 2016
Directional chemical oxide etch technique
IBM0 citations42