Inventor
LEBONHEUR VASSOUDEVANE
US6 patents
Patents
6 patentsUS6617683B2Sep 9, 2003
Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material
INTEL CORP99 citations96
US6794225B2Sep 21, 2004
Surface treatment for microelectronic device substrate
INTEL CORP19 citations91
US6975025B2Dec 13, 2005
Semiconductor chip package and method of manufacturing same
INTEL CORP17 citations79
US7147735B2Dec 12, 2006
Vibratable die attachment tool
INTEL CORP7 citations64
US6908789B1Jun 21, 2005
Method of making a microelectronic assembly
INTEL CORP4 citations53
US7514300B2Apr 7, 2009
Mold compound cap in a flip chip multi-matrix array package and process of making same
INTEL CORP1 citations50