Inventor
CHEN LUNG-TAI
TW14 patents
⚠️ This page may combine multiple inventors who share the name “CHEN LUNG-TAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IND TECH RES INST
6 patentsUS5903052AMay 11, 1999
Structure for semiconductor package for improving the efficiency of spreading heat
IND TECH RES INST329 citations95
US5695109ADec 9, 1997
Solder paste inter-layer alignment apparatus for area-array on-board rework
IND TECH RES INST25 citations90
US7791181B2Sep 7, 2010
Device structure with preformed ring and method therefor
IND TECH RES INST4 citations62
US12191219B2Jan 7, 2025
Gas-permeable package lid of chip package structure and manufacturing method thereof
IND TECH RES INST1 citations61
US7915065B2Mar 29, 2011
Wafer level sensing package and manufacturing process thereof
IND TECH RES INST2 citations61
US7973454B1Jul 5, 2011
Vacuum hermetic organic packaging carrier and sensor device package
IND TECH RES INST2 citations60
CHEN LUNG-TAI
6 patentsUS8643125B2Feb 4, 2014
Structure and process for microelectromechanical system-based sensor
CHEN LUNG-TAI4 citations72
US9445212B2Sep 13, 2016
MEMS microphone module and manufacturing process thereof
CHEN LUNG-TAI6 citations71
US8763457B2Jul 1, 2014
Sensing device and manufacturing method thereof
CHEN LUNG-TAI2 citations60
US9343651B2May 17, 2016
Organic packaging carrier
CHEN LUNG-TAI2 citations59
US9133018B2Sep 15, 2015
Structure and fabrication method of a sensing device
CHEN LUNG-TAI0 citations50
US8421216B2Apr 16, 2013
Vacuum hermetic organic packaging carrier
CHEN LUNG-TAI1 citations49