Inventor
LUIJTEN RONALD P
CH31 patents
⚠️ This page may combine multiple inventors who share the name “LUIJTEN RONALD P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS6768716B1Jul 27, 2004
Load balancing system, apparatus and method
IBM71 citations97
US5008878AApr 16, 1991
High-speed modular switching apparatus for circuit and packet switched traffic
IBM86 citations93
US7145873B2Dec 5, 2006
Switching arrangement and method with separated output buffers
IBM25 citations92
US7103050B1Sep 5, 2006
Method and means for determining the used bandwidth on a connection
IBM24 citations92
US6821026B2Nov 23, 2004
Redundant configurable VCSEL laser array optical light source
IBM21 citations92
US6044077AMar 28, 2000
Method and apparatus for ATM switching
IBM50 citations92
US6023466AFeb 8, 2000
Bit mapping apparatus and method
IBM25 citations91
US7146478B2Dec 5, 2006
Cache entry selection method and apparatus
IBM17 citations77
US6793407B2Sep 21, 2004
Manufacturable optical connection assemblies
IBM9 citations74
US10050362B2Aug 14, 2018
Electronic circuit card with connector edge having alternated TX and RX pins assignment
IBM2 citations72
US9832874B2Nov 28, 2017
Method of forming a printed circuit board assembly
IBM2 citations71
US9414493B2Aug 9, 2016
Assembly of printed circuit boards
IBM4 citations71
US6674716B1Jan 6, 2004
Cell compliance decision method and apparatus
IBM3 citations63
US11096290B2Aug 17, 2021
Printed circuit board with edge soldering for high-density packages and assemblies
IBM0 citations60
US7304949B2Dec 4, 2007
Scalable link-level flow-control for a switching device
IBM5 citations60
US6996116B2Feb 7, 2006
Switching nodes and interface modules for data networks
IBM3 citations60
US7197540B2Mar 27, 2007
Control logic implementation for a non-blocking switch network
IBM0 citations51
US7392355B2Jun 24, 2008
Memory sharing mechanism based on priority elevation
IBM0 citations49
US10098241B2Oct 9, 2018
Printed circuit board with edge soldering for high-density packages and assemblies
IBM0 citations48
US8751980B2Jun 10, 2014
Automatic wafer data sample planning and review
IBM1 citations46
US10031562B2Jul 24, 2018
Cooling electronic components and supplying power to the electronic components
IBM0 citations41
US9356867B2May 31, 2016
Lossless socket-based layer 4 transport (reliability) system for a converged ethernet network
IBM0 citations36