Inventor
TAY CHENG SIEW
MY9 patents
⚠️ This page may combine multiple inventors who share the name “TAY CHENG SIEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS7173342B2Feb 6, 2007
Method and apparatus for reducing electrical interconnection fatigue
INTEL CORP8 citations71
US7242084B2Jul 10, 2007
Apparatuses and associated methods for improved solder joint reliability
INTEL CORP6 citations59
US7326859B2Feb 5, 2008
Printed circuit boards having pads for solder balls and methods for the implementation thereof
INTEL CORP3 citations57
US7789285B2Sep 7, 2010
Solder printing process to reduce void formation in a microvia
INTEL CORP2 citations56
US7331503B2Feb 19, 2008
Solder printing process to reduce void formation in a microvia
INTEL CORP0 citations45
US7400040B2Jul 15, 2008
Thermal interface apparatus, systems, and methods
INTEL CORP0 citations34
TAY CHENG SIEW
3 patentsUS7642660B2Jan 5, 2010
Method and apparatus for reducing electrical interconnection fatigue
TAY CHENG SIEW71 citations94
US8079011B2Dec 13, 2011
Printed circuit boards having pads for solder balls and methods for the implementation thereof
TAY CHENG SIEW3 citations55
US8533657B2Sep 10, 2013
Printed circuit boards having pads for solder balls and methods for the implementation thereof
TAY CHENG SIEW0 citations45