Inventor
YU CHEEMAN
US25 patents
⚠️ This page may combine multiple inventors who share the name “YU CHEEMAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK TECHNOLOGIES INC
7 patentsUS8053276B2Nov 8, 2011
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
SANDISK TECHNOLOGIES INC10 citations81
US8053880B2Nov 8, 2011
Stacked, interconnected semiconductor package
SANDISK TECHNOLOGIES INC4 citations63
US9230919B2Jan 5, 2016
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK TECHNOLOGIES INC2 citations62
US8878368B2Nov 4, 2014
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK TECHNOLOGIES INC3 citations62
US10051733B2Aug 14, 2018
Printed circuit board with coextensive electrical connectors and contact pad areas
SANDISK TECHNOLOGIES INC0 citations52
US8349655B2Jan 8, 2013
Method of fabricating a two-sided die in a four-sided leadframe based package
SANDISK TECHNOLOGIES INC0 citations52
US8853863B2Oct 7, 2014
Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
SANDISK TECHNOLOGIES INC1 citations50
LIAO CHIH-CHIN
3 patentsUS8415808B2Apr 9, 2013
Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
LIAO CHIH-CHIN24 citations89
US8502375B2Aug 6, 2013
Corrugated die edge for stacked die semiconductor package
LIAO CHIH-CHIN2 citations61
US8217522B2Jul 10, 2012
Printed circuit board with coextensive electrical connectors and contact pad areas
LIAO CHIH-CHIN0 citations51
SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD
3 patentsUS9240393B2Jan 19, 2016
High yield semiconductor device
SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD9 citations80
US9362244B2Jun 7, 2016
Wire tail connector for a semiconductor device
SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD0 citations51
US9236368B2Jan 12, 2016
Semiconductor device including embedded controller die and method of making same
SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD0 citations49
TAKIAR HEM
2 patentsYU CHEEMAN
2 patentsCHANG CHE-JUNG
2 patentsUS8482139B2Jul 9, 2013
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
CHANG CHE-JUNG0 citations47
US8232145B2Jul 31, 2012
Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards
CHANG CHE-JUNG0 citations47