Inventor

CHIU CHIN-TIEN

TW73 patents

⚠️ This page may combine multiple inventors who share the name “CHIU CHIN-TIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIU CHIN-TIEN

WESTERN DIGITAL TECH INC

Thermoelectric semiconductor device and method of making same

Semiconductor device including reinforced corner supports

Semiconductor device including vertically stacked semiconductor dies

Multi-module integrated interposer and semiconductor device formed therefrom

High capacity semiconductor device including bifurcated memory module

Semiconductor device including stacked die with continuous integral via holes

Semiconductor device including dummy pull-down wire bonds

Semiconductor device including high speed heterogeneous integrated controller and cache

Method of forming a semiconductor device including vertical contact fingers

Semiconductor die and semiconductor package

Semiconductor device including conductive bumps to improve EMI/RFI shielding

Side contact pads for high-speed memory card

SANDISK CORP

Printed circuit board with coextensive electrical connectors and contact pad areas

Substrate warpage control and continuous electrical enhancement

Method of manufacturing flash memory cards

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Padless substrate for surface mounted components

Semiconductor package having through holes for molding back side of package

Rounded contact fingers on substrate/PCB for crack prevention

Method of fabricating a semiconductor die having a redistribution layer

Semiconductor die having a distribution layer

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Hidden plating traces

SANDISK INFORMATION TECH SHANGHAI CO LTD

Semiconductor device including interconnected package on package

Angled die semiconductor device

Fan out semiconductor device including a plurality of semiconductor die

Semiconductor device including electromagnetic absorption and shielding

Semiconductor device

Semiconductor device including vertically integrated groups of semiconductor packages

Semiconductor package and method of fabricating semiconductor package

Semiconductor device including control switches to reduce pin capacitance

SILICONWARE PRECISION INDUSTRIES CO LTD

Warpage-preventive circuit board and method for fabricating the same

Warpage preventing substrate

Method for fabricating a warpage-preventive circuit board

Semiconductor package with chip supporting member

Semiconductor package with chip supporting structure

Printed circuit board and method for fabricating the same

SANDISK TECHNOLOGIES INC

Bifacial semiconductor wafer

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

SANDISK SEMICONDUCTOR (SHANGHAI) CO LTD

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

LU ZHONG

Waterfall wire bonding

SANDISK SEMICONDUCTOR SHANGHAI CO LTD

Heterogeneous fan-out structures for memory devices

CHIU CHIN-TIEN

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

GU WEI

Semiconductor die laminating device with independent drives

SANDISK INFORMATION TECHNOLOGY SHANGHAI CO LTD

Semiconductor device including alternating stepped semiconductor die stacks

SANDISK INFORMATION TECH SHANGAHAI CO LTD

Vertical semiconductor device having a stacked die block

FU PENG

EMI shielding and thermal dissipation for semiconductor device

HUANG DACHENG

Semiconductor device including electromagnetic absorption and shielding

TAKIAR HEM

Hidden plating traces