Inventor
CHEN HAN-SHIAO
TW18 patents
⚠️ This page may combine multiple inventors who share the name “CHEN HAN-SHIAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SANDISK CORP
6 patentsUS7746661B2Jun 29, 2010
Printed circuit board with coextensive electrical connectors and contact pad areas
SANDISK CORP8 citations84
US7538438B2May 26, 2009
Substrate warpage control and continuous electrical enhancement
SANDISK CORP15 citations84
US7355283B2Apr 8, 2008
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK CORP10 citations84
US7967184B2Jun 28, 2011
Padless substrate for surface mounted components
SANDISK CORP4 citations62
US7806731B2Oct 5, 2010
Rounded contact fingers on substrate/PCB for crack prevention
SANDISK CORP5 citations62
US7592699B2Sep 22, 2009
Hidden plating traces
SANDISK CORP1 citations62
WESTERN DIGITAL TECH INC
3 patentsUS10249587B1Apr 2, 2019
Semiconductor device including optional pad interconnect
WESTERN DIGITAL TECH INC11 citations83
US11031372B2Jun 8, 2021
Semiconductor device including dummy pull-down wire bonds
WESTERN DIGITAL TECH INC0 citations62
US11139277B2Oct 5, 2021
Semiconductor device including contact fingers on opposed surfaces
WESTERN DIGITAL TECH INC0 citations46
SANDISK TECHNOLOGIES INC
3 patentsUS9230919B2Jan 5, 2016
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK TECHNOLOGIES INC2 citations62
US8878368B2Nov 4, 2014
Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
SANDISK TECHNOLOGIES INC3 citations62
US10051733B2Aug 14, 2018
Printed circuit board with coextensive electrical connectors and contact pad areas
SANDISK TECHNOLOGIES INC0 citations52