Inventor

GURUMURTHY CHARAN

US20 patents

⚠️ This page may combine multiple inventors who share the name “GURUMURTHY CHARAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GURUMURTHY CHARAN

INTEL CORP

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Embedding device in substrate cavity

Forming a helical inductor

Substrate package with through holes for high speed I/O flex cable

Method of using micro-contact imprinted features for formation of electrical interconnects for substrates

Integrated circuit and process for fabricating thereof

System, apparatus, and method for advanced solder bumping

Assembly of thin die coreless package

Method of forming collapse chip connection bumps on a semiconductor substrate

Optical die structures and associated package substrates

Method of making substrate package with through holes for high speed I/O flex cable

System, apparatus, and method for advanced solder bumping

LI YONGGANG

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method

TOYAMA MUNEHIRO

Embedding device in substrate cavity

BCHIR OMAR J

Substrates for optical die structures

PANG MENGZHI

Doping of lead-free solder alloys and structures formed thereby

SOTO JAVIER

Processes of making pad-less interconnect for electrical coreless substrate

GURUMURTHY CHARAN

Integrated circuit and process for fabricating thereof