Inventor
HLAD MARK
US6 patents
⚠️ This page may combine multiple inventors who share the name “HLAD MARK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS7888784B2Feb 15, 2011
Substrate package with through holes for high speed I/O flex cable
INTEL CORP11 citations82
US8353101B2Jan 15, 2013
Method of making substrate package with through holes for high speed I/O flex cable
INTEL CORP3 citations57
US10856424B2Dec 1, 2020
Electronic assembly that includes void free holes
INTEL CORP0 citations50
US10734282B2Aug 4, 2020
Substrate conductor structure and method
INTEL CORP0 citations50
US10121701B2Nov 6, 2018
Substrate conductor structure and method
INTEL CORP0 citations50