Inventor
YEE ABRAHAM F
US14 patents
⚠️ This page may combine multiple inventors who share the name “YEE ABRAHAM F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NVIDIA CORP
7 patentsUS8618651B1Dec 31, 2013
Buried TSVs used for decaps
NVIDIA CORP34 citations92
US7964422B1Jun 21, 2011
Method and system for controlling a semiconductor fabrication process
NVIDIA CORP7 citations83
US9831184B2Nov 28, 2017
Buried TSVs used for decaps
NVIDIA CORP3 citations72
US9530714B2Dec 27, 2016
Low-profile chip package with modified heat spreader
NVIDIA CORP3 citations71
US9368422B2Jun 14, 2016
Absorbing excess under-fill flow with a solder trench
NVIDIA CORP2 citations59
US9379202B2Jun 28, 2016
Decoupling capacitors for interposers
NVIDIA CORP0 citations41
US10096534B2Oct 9, 2018
Thermal performance of logic chip in a package-on-package structure
NVIDIA CORP0 citations36
LSI LOGIC CORP
4 patentsUS5917207AJun 29, 1999
Programmable polysilicon gate array base cell architecture
LSI LOGIC CORP135 citations95
US5777383AJul 7, 1998
Semiconductor chip package with interconnect layers and routing and testing methods
LSI LOGIC CORP70 citations92
US5691218ANov 25, 1997
Method of fabricating a programmable polysilicon gate array base cell structure
LSI LOGIC CORP11 citations72
US5235202AAug 10, 1993
Radiation hardened field dielectric utilizing BPSG
LSI LOGIC CORP3 citations57