Inventor
YING XUEJUN
US13 patents
⚠️ This page may combine multiple inventors who share the name “YING XUEJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MAXIM INTEGRATED PRODUCTS
6 patentsUS8963287B1Feb 24, 2015
Deep trench capacitor with conformally-deposited conductive layers having compressive stress
MAXIM INTEGRATED PRODUCTS8 citations82
US9196587B2Nov 24, 2015
Semiconductor device having a die and through substrate-via
MAXIM INTEGRATED PRODUCTS8 citations80
US9105750B1Aug 11, 2015
Semiconductor device having a through-substrate via
MAXIM INTEGRATED PRODUCTS4 citations71
US9659900B2May 23, 2017
Semiconductor device having a die and through-substrate via
MAXIM INTEGRATED PRODUCTS2 citations69
US9331048B2May 3, 2016
Bonded stacked wafers and methods of electroplating bonded stacked wafers
MAXIM INTEGRATED PRODUCTS1 citations51
US9040386B2May 26, 2015
Method for varied topographic MEMS cap process
MAXIM INTEGRATED PRODUCTS0 citations47